Inventor · disambiguated record
Helder Lee
Also filed as: LEE HELDER · LEE HELDER T
14 granted patents·3 pending applications·36 citations·filing 2008–2024
88Inventor score
Technology areasH10P
Top patents by PatentIndex Score
17 records- 0195US11469123B2Mapping of a replacement parts storage containerAPPLIED MATERIALS INC·Filed 2020·Granted Oct 11, 2022·4 cites·15 claims
- 0292US10964584B2Process kit ring adaptorAPPLIED MATERIALS INC·Filed 2019·Granted Mar 30, 2021·7 cites·20 claims
- 0392US10192765B2Substrate processing systems, apparatus, and methods with factory interface environmental controlsAPPLIED MATERIALS INC·Filed 2014·Granted Jan 29, 2019·13 cites·23 claims
- 0484US12456638B2Methods and systems for temperature control for a substrateAPPLIED MATERIALS INC·Filed 2024·Granted Oct 28, 2025·0 cites·20 claims
- 0577US12014944B2Mapping of a replacement parts storage containerAPPLIED MATERIALS INC·Filed 2022·Granted Jun 18, 2024·0 cites·20 claims
- 0676US2025087524A1Process kit enclosure systemAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0775US2022392789A1Substrate processing systems, apparatus, and methods with factory interface environmental controlsAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 0874US9091491B2Cooling plates and semiconductor apparatus thereofLEE HELDER·Filed 2008·Granted Jul 28, 2015·8 cites·24 claims
- 0973US8377213B2Slit valve having increased flow uniformityAPPLIED MATERIALS INC·Filed 2008·Granted Feb 19, 2013·4 cites·15 claims
- 1066US11842917B2Process kit ring adaptorAPPLIED MATERIALS INC·Filed 2021·Granted Dec 12, 2023·0 cites·20 claims
- 1164US11282724B2Substrate processing systems, apparatus, and methods with factory interface environmental controlsAPPLIED MATERIALS INC·Filed 2019·Granted Mar 22, 2022·0 cites·13 claims
- 1261US11450539B2Substrate processing systems, apparatus, and methods with factory interface environmental controlsAPPLIED MATERIALS INC·Filed 2018·Granted Sep 20, 2022·0 cites·13 claims
- 1356US12165905B2Process kit enclosure systemAPPLIED MATERIALS INC·Filed 2019·Granted Dec 10, 2024·0 cites·20 claims
- 1450US9423042B2Slit valve having increased flow uniformityAPPLIED MATERIALS INC·Filed 2013·Granted Aug 23, 2016·0 cites·20 claims
- 1550US2025218831A1Constructing a substrate topology map based on measured propertiesAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1648US12325140B2Grip-based transport speeds for transporting objects at a manufacturing systemAPPLIED MATERIALS INC·Filed 2022·Granted Jun 10, 2025·0 cites·20 claims
- 1733USD1107089SSubstrate-handling robot end effectorAPPLIED MATERIALS INC·Filed 2023·Granted Dec 23, 2025·0 cites·1 claims
Join the waitlist — get patent alerts
Get an alert when Helder Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →