Inventor · disambiguated record
Heny Lin
Also filed as: LIN HENY · LIN HENY W
8 granted patents·2 pending applications·202 citations·filing 2000–2016
87Inventor score
Technology areasH10W
Files withINT RECTIFIER CORP4INFINEON TECHNOLOGIES AMERICAS CORP2LIN HENY2GRANT WILLIAM1HAUENSTEIN HENNING M1
Top patents by PatentIndex Score
10 records- 0193US6362964B1Flexible power assemblyINT RECTIFIER CORP·Filed 2000·Granted Mar 26, 2002·129 cites·30 claims
- 0289US8847408B2III-nitride transistor stacked with FET in a packageLIN HENY·Filed 2011·Granted Sep 30, 2014·15 cites·20 claims
- 0382US7149088B2Half-bridge power module with insert molded heatsinksINT RECTIFIER CORP·Filed 2004·Granted Dec 12, 2006·40 cites·23 claims
- 0477US9892997B2Adaptable molded leadframe package and related methodINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2016·Granted Feb 13, 2018·3 cites·20 claims
- 0573US9530774B2Semiconductor package for III-nitride transistor stacked with diodeINFINEON TECHNOLOGIES AMERICAS CORP·Filed 2015·Granted Dec 27, 2016·2 cites·12 claims
- 0671US8963338B2III-nitride transistor stacked with diode in a packageLIN HENY·Filed 2011·Granted Feb 24, 2015·3 cites·10 claims
- 0757US7042730B2Non-isolated heatsink(s) for power modulesINT RECTIFIER CORP·Filed 2003·Granted May 9, 2006·10 cites·10 claims
- 0855US9312245B2III-nitride device and FET in a packageINT RECTIFIER CORP·Filed 2014·Granted Apr 12, 2016·0 cites·8 claims
- 0941US2007257343A1Die-on-leadframe (dol) with high voltage isolationHAUENSTEIN HENNING M·Filed 2007·Application pending·0 cites
- 1034US2006290689A1Semiconductor half-bridge module with low inductanceGRANT WILLIAM·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →