Inventor · disambiguated record
Hermen Liu
Also filed as: LIU HERMEN
15 granted patents·277 citations·filing 1998–2004
94Inventor score
Files withUNITED MICROELECTRONICS CORP15
Top patents by PatentIndex Score
15 records- 0188US6455943B1Bonding pad structure of semiconductor device having improved bondabilityUNITED MICROELECTRONICS CORP·Filed 2001·Granted Sep 24, 2002·51 cites·10 claims
- 0281US6316727B1Multi-chip semiconductor packageUNITED MICROELECTRONICS CORP·Filed 1999·Granted Nov 13, 2001·67 cites·8 claims
- 0377US6297561B1Semiconductor chipUNITED MICROELECTRONICS CORP·Filed 2000·Granted Oct 2, 2001·25 cites·10 claims
- 0470US6228689B1Trench style bump and application of the sameUNITED MICROELECTRONICS CORP·Filed 1998·Granted May 8, 2001·40 cites·10 claims
- 0567US6251694B1Method of testing and packaging a semiconductor chipUNITED MICROELECTRONICS CORP·Filed 1999·Granted Jun 26, 2001·34 cites·9 claims
- 0663US6424025B1Cross grid array package structure and method of manufactureUNITED MICROELECTRONICS CORP·Filed 2000·Granted Jul 23, 2002·10 cites·13 claims
- 0762US6664142B2Laser repair operationUNITED MICROELECTRONICS CORP·Filed 2002·Granted Dec 16, 2003·8 cites·4 claims
- 0859US7211500B2Pre-process before cutting a wafer and method of cutting a waferUNITED MICROELECTRONICS CORP·Filed 2004·Granted May 1, 2007·6 cites·13 claims
- 0958US7170167B2Method for manufacturing wafer level chip scale package structureUNITED MICROELECTRONICS CORP·Filed 2004·Granted Jan 30, 2007·8 cites·9 claims
- 1053US6667195B2Laser repair operationUNITED MICROELECTRONICS CORP·Filed 2001·Granted Dec 23, 2003·4 cites·10 claims
- 1150US6794606B2Laser repair operationUNITED MICROELECTRONICS CORP·Filed 2003·Granted Sep 21, 2004·3 cites·3 claims
- 1247US6388326B2Bonding pad on a semiconductor chipUNITED MICROELECTRONICS CORP·Filed 2001·Granted May 14, 2002·2 cites·6 claims
- 1347US6190938B1Cross grid array package structure and method of manufactureUNITED MICROELECTRONICS CORP·Filed 1998·Granted Feb 20, 2001·12 cites·20 claims
- 1431US6121063AMethod of testing a ball grid array ICUNITED MICROELECTRONICS CORP·Filed 1998·Granted Sep 19, 2000·7 cites·22 claims
- 1530US6372621B1Method of forming a bonding pad on a semiconductor chipUNITED MICROELECTRONICS CORP·Filed 1999·Granted Apr 16, 2002·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →