Inventor · disambiguated record
Heng-Ming Nien
Also filed as: NIEN HENG MING
6 granted patents·2 pending applications·0 citations·filing 2021–2024
64Inventor score
Files withUNIMICRON TECHNOLOGY CORP8
Top patents by PatentIndex Score
8 records- 0174US12052815B2Manufacturing method of circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2023·Granted Jul 30, 2024·0 cites·15 claims
- 0272US11686008B2Electroplating apparatus and electroplating methodUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Jun 27, 2023·0 cites·19 claims
- 0365US11785707B2Circuit board and manufacturing method thereof and electronic deviceUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Oct 10, 2023·0 cites·9 claims
- 0460US11859302B2Electroplating apparatus and electroplating methodUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Jan 2, 2024·0 cites·10 claims
- 0559US12439529B2Plurality of build-up layers in a circuit board structureUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted Oct 7, 2025·0 cites·11 claims
- 0659US2025365865A1Substrate structureUNIMICRON TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0756US11792918B2Co-axial via structureUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Oct 17, 2023·0 cites·7 claims
- 0854US2023120741A1Electroplating apparatus and electroplating methodUNIMICRON TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →