Inventor · disambiguated record
Henry A. Nye, Iii
Also filed as: NYE HENRY A III · NYE III HENRY A · NYE III HENRY ATKINSON
22 granted patents·3 pending applications·880 citations·filing 1992–2011
97Inventor score
Top patents by PatentIndex Score
25 records- 0194US7517736B2Structure and method of chemically formed anchored metallic viasIBM·Filed 2006·Granted Apr 14, 2009·34 cites·7 claims
- 0293US5503286AElectroplated solder terminalIBM·Filed 1994·Granted Apr 2, 1996·131 cites·16 claims
- 0391US5629564AElectroplated solder terminalIBM·Filed 1995·Granted May 13, 1997·111 cites·21 claims
- 0490US6261945B1Crackstop and oxygen barrier for low-K dielectric integrated circuitsIBM·Filed 2000·Granted Jul 17, 2001·73 cites·12 claims
- 0588US6908841B2Support structures for wirebond regions of contact pads over low modulus materialsIBM·Filed 2002·Granted Jun 21, 2005·56 cites·36 claims
- 0688US5268072AEtching processes for avoiding edge stress in semiconductor chip solder bumpsIBM·Filed 1992·Granted Dec 7, 1993·119 cites·14 claims
- 0786US6821890B2Method for improving adhesion to copperIBM·Filed 2001·Granted Nov 23, 2004·37 cites·16 claims
- 0886US6486557B1Hybrid dielectric structure for improving the stiffness of back end of the line structuresIBM·Filed 2000·Granted Nov 26, 2002·48 cites·11 claims
- 0983US6133136ARobust interconnect structureIBM·Filed 1999·Granted Oct 17, 2000·77 cites·37 claims
- 1082US5904156ADry film resist removal in the presence of electroplated C4'sIBM·Filed 1997·Granted May 18, 1999·74 cites·9 claims
- 1177US7273803B2Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structureIBM·Filed 2003·Granted Sep 25, 2007·16 cites·14 claims
- 1275US6478212B1Bond pad structure and method for reduced downward force wirebondingIBM·Filed 2001·Granted Nov 12, 2002·22 cites·21 claims
- 1374US8026613B2Interconnections for flip-chip using lead-free solders and having reaction barrier layersIBM·Filed 2008·Granted Sep 27, 2011·4 cites·6 claims
- 1474US7410833B2Interconnections for flip-chip using lead-free solders and having reaction barrier layersIBM·Filed 2004·Granted Aug 12, 2008·14 cites·18 claims
- 1572US6531759B2Alpha particle shield for integrated circuitIBM·Filed 2001·Granted Mar 11, 2003·19 cites·6 claims
- 1671US7923849B2Interconnections for flip-chip using lead-free solders and having reaction barrier layersIBM·Filed 2008·Granted Apr 12, 2011·3 cites·9 claims
- 1769US6271595B1Method for improving adhesion to copperIBM·Filed 1999·Granted Aug 7, 2001·30 cites·15 claims
- 1859US7276296B2Immersion plating and plated structuresIBM·Filed 2005·Granted Oct 2, 2007·1 cites·4 claims
- 1955US6784516B1Insulative cap for laser fusingIBM·Filed 2000·Granted Aug 31, 2004·5 cites·10 claims
- 2050US7037559B2Immersion plating and plated structuresIBM·Filed 2003·Granted May 2, 2006·3 cites·41 claims
- 2150US2012012642A1Interconnections for flip-chip using lead-free solders and having reaction barrier layersFOGEL KEITH E·Filed 2011·Application pending·0 cites
- 2248US6946379B2Insulative cap for laser fusingIBM·Filed 2004·Granted Sep 20, 2005·2 cites·20 claims
- 2341US6900142B2Inhibition of tin oxide formation in lead free interconnect formationIBM·Filed 2003·Granted May 31, 2005·1 cites·9 claims
- 2441US2008008900A1Ball Limiting Metallurgy, Interconnection Structure Including the Same, and Method of Forming an Interconnection StructureCHENG YU-TING·Filed 2007·Application pending·0 cites
- 2538US2009026587A1Gradient deposition of low-k cvd materialsIBM·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →