Inventor · disambiguated record
Heng-Cheng Pai
Also filed as: PAI HENG-CHENG
6 granted patents·3 pending applications·16 citations·filing 2007–2025
75Inventor score
Top patents by PatentIndex Score
9 records- 0190US11853042B2Part, sensor, and metrology data integrationAPPLIED MATERIALS INC·Filed 2021·Granted Dec 26, 2023·2 cites·17 claims
- 0283US11592812B2Sensor metrology data integrationAPPLIED MATERIALS INC·Filed 2020·Granted Feb 28, 2023·2 cites·20 claims
- 0379US2025271847A1Data intergrationAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 0478US8219349B1Test management systemSCHWARZ YORAM·Filed 2007·Granted Jul 10, 2012·11 cites·26 claims
- 0575US2024061409A1Part, sensor, and metrology data integrationAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0674US12366853B2Sensor metrology data integrationAPPLIED MATERIALS INC·Filed 2023·Granted Jul 22, 2025·0 cites·20 claims
- 0755US8295969B2Combinatorial processing management systemASHIZAWA YOSHIKI·Filed 2011·Granted Oct 23, 2012·1 cites·8 claims
- 0846US11157661B2Process development visualization toolAPPLIED MATERIALS INC·Filed 2019·Granted Oct 26, 2021·0 cites·20 claims
- 0936US2014188264A1Workflow Manager and Bar Coding System for Processing of Samples/Substrates in HPC (High Productivity Combinatorial) R&D EnvironmentINTERMOLECULAR INC·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →