Inventor · disambiguated record
Helmut Rinck
Also filed as: RINCK HELMUT
12 granted patents·6 pending applications·73 citations·filing 1989–2024
88Inventor score
Top patents by PatentIndex Score
18 records- 0183US11011381B2Patterning platinum by alloying and etching platinum alloyTEXAS INSTRUMENTS INC·Filed 2019·Granted May 18, 2021·2 cites·25 claims
- 0281US10504733B2Etching platinum-containing thin film using protective cap layerTEXAS INSTRUMENTS INC·Filed 2017·Granted Dec 10, 2019·3 cites·17 claims
- 0380US5080484AMethod of measuring the contact angle of wetting liquid on a solid surfaceTEXAS INSTRUMENTS DEUTSCHLAND·Filed 1989·Granted Jan 14, 1992·43 cites·7 claims
- 0477US2024222470A1Etching platinum-containing thin film using protective cap layerTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0576US9960135B2Metal bond pad with cobalt interconnect layer and solder thereonTEXAS INSTRUMENTS INC·Filed 2015·Granted May 1, 2018·5 cites·17 claims
- 0673US2023253211A1Patterning platinum by alloying and etching platinum alloyTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 0770US11658034B2Patterning platinum by alloying and etching platinum alloyTEXAS INSTRUMENTS INC·Filed 2021·Granted May 23, 2023·0 cites·19 claims
- 0869US11929423B2Etching platinum-containing thin film using protective cap layerTEXAS INSTRUMENTS INC·Filed 2021·Granted Mar 12, 2024·0 cites·24 claims
- 0961US10297497B2Sacrificial layer for platinum patterningTEXAS INSTRUMENTS INC·Filed 2017·Granted May 21, 2019·1 cites·20 claims
- 1061US2023184713A1Integrated circuit FLUID sensorTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 1160US11069530B2Etching platinum-containing thin film using protective cap layerTEXAS INSTRUMENTS INC·Filed 2019·Granted Jul 20, 2021·0 cites·17 claims
- 1257US4969973AMethod for etching an electrically conductive layer applied to a substrateTEXAS INSTRUMENTS DEUTSCHLAND·Filed 1989·Granted Nov 13, 1990·12 cites·4 claims
- 1357US2025120157A1Semiconductor device with slanted field plateTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1453US2023187390A1Semiconductor die with dissolvable metal layerTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 1548US10714439B2Electronic device having cobalt coated aluminum contact padsTEXAS INSTRUMENTS INC·Filed 2018·Granted Jul 14, 2020·0 cites·14 claims
- 1640US2018218993A1Metal bond pad with cobalt interconnect layer and solder thereonTEXAS INSTRUMENTS INC·Filed 2018·Application pending·0 cites
- 1734US9230852B2Integrated circuit (IC) having electrically conductive corrosion protecting cap over bond padsTEXAS INSTRUMENTS INC·Filed 2013·Granted Jan 5, 2016·0 cites·17 claims
- 1831US5019205AApparatus for wet etching of thin filmsTEXAS INSTRUMENTS DEUTSCHLAND·Filed 1989·Granted May 28, 1991·7 cites·4 claims
Join the waitlist — get patent alerts
Get an alert when Helmut Rinck files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →