Inventor · disambiguated record
Heribert Zull
Also filed as: ZULL HERIBERT
18 granted patents·3 pending applications·53 citations·filing 2002–2019
92Inventor score
Files withOSRAM OPTO SEMICONDUCTORS GMBH7SCHMID CHRISTIAN6ALBRECHT TONY1BAUR ELMAR1GÜNTHER EWALD KARL MICHAEL1
Top patents by PatentIndex Score
21 records- 0191US8658442B2Method for producing an electronic component and electronic componentSCHMID CHRISTIAN·Filed 2009·Granted Feb 25, 2014·12 cites·14 claims
- 0290US8633585B2Device comprising an encapsulation unitSCHMID CHRISTIAN·Filed 2009·Granted Jan 21, 2014·10 cites·13 claims
- 0389US10026625B2Device comprising an encapsulation unitSCHMID CHRISTIAN·Filed 2014·Granted Jul 17, 2018·6 cites·19 claims
- 0483US8916397B2Method for producing an electronic component and electronic componentSCHMID CHRISTIAN·Filed 2009·Granted Dec 23, 2014·5 cites·12 claims
- 0579US9647186B2Method for producing an electronic component and electronic componentSCHMID CHRISTIAN·Filed 2014·Granted May 9, 2017·2 cites·15 claims
- 0677US9721940B2Radiation-emitting semiconductor chip and method of producing radiation-emitting semiconductor chipsOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2014·Granted Aug 1, 2017·4 cites·19 claims
- 0775US9704945B2Carrier substrate and method for producing semiconductor chipsGÜNTHER EWALD KARL MICHAEL·Filed 2012·Granted Jul 11, 2017·5 cites·13 claims
- 0871US9324615B2Method for producing a semiconductor bodyPERZLMAIER KORBINIAN·Filed 2012·Granted Apr 26, 2016·2 cites·11 claims
- 0970US9219199B2Method of producing an optoelectronic component having a sulfur-adhesion layer bonded to a dielectric layerLINDBERG GUDRUN·Filed 2012·Granted Dec 22, 2015·2 cites·9 claims
- 1067US10224393B2Method of producing semiconductor chips that efficiently dissipate heatOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2017·Granted Mar 5, 2019·1 cites·9 claims
- 1164US8969175B2Method for producing singulated semiconductor devicesOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2013·Granted Mar 3, 2015·1 cites·13 claims
- 1264US8569079B2Method for producing an optoelectronic semiconductor componentBAUR ELMAR·Filed 2010·Granted Oct 29, 2013·1 cites·11 claims
- 1361US10297469B2Method for producing an electronic component and electronic componentSCHMID CHRISTIAN·Filed 2014·Granted May 21, 2019·0 cites·18 claims
- 1459US11955588B2Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor componentOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2019·Granted Apr 9, 2024·0 cites·17 claims
- 1556US9165816B2Method for singulating a component composite assemblyZULL HERIBERT·Filed 2012·Granted Oct 20, 2015·1 cites·19 claims
- 1655US9768344B2Method of producing a semiconductor bodyOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2016·Granted Sep 19, 2017·0 cites·11 claims
- 1753US2017345966A1Method of producing a semiconductor bodyOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2017·Application pending·0 cites
- 1845US6661033B2LED with a coupling-out structureOSRAM OPTO SEMICONDUCTORS GMBH·Filed 2002·Granted Dec 9, 2003·1 cites·9 claims
- 1944US8772911B2Semiconductor diode and method for producing a semiconductor diodeALBRECHT TONY·Filed 2011·Granted Jul 8, 2014·0 cites·6 claims
- 2041US2008290356A1Reflective Layered System Comprising a Plurality of Layers that are to be Applied to a III/V Compound Semiconductor MaterialKRAUTER GERTRUD·Filed 2005·Application pending·0 cites
- 2138US2006151428A1Method for roughening a surface of a body, and optoelectronic componentWINDISCH REINER·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →