Inventor · disambiguated record
Hideta Arai
Also filed as: ARAI HIDETA
18 granted patents·7 pending applications·41 citations·filing 1999–2018
90Inventor score
Top patents by PatentIndex Score
25 records- 0190US10925171B2Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, heat dissipation substrate, and method for manufacturing electronic deviceJX NIPPON MINING & METALS CORP·Filed 2018·Granted Feb 16, 2021·3 cites·22 claims
- 0290US9060431B2Liquid crystal polymer copper-clad laminate and copper foil used for said laminateARAI HIDETA·Filed 2012·Granted Jun 16, 2015·7 cites·34 claims
- 0389US9724896B2Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring boardJX NIPPON MINING & METALS CORP·Filed 2015·Granted Aug 8, 2017·8 cites·21 claims
- 0478US9504149B2Surface treated copper foil and laminate using the sameJX NIPPON MINING & METALS CORP·Filed 2013·Granted Nov 22, 2016·3 cites·19 claims
- 0578US8524378B2Copper foil for printed circuitARAI HIDETA·Filed 2009·Granted Sep 3, 2013·8 cites·11 claims
- 0668US10464291B2Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring boardJX NIPPON MINING & METALS CORP·Filed 2017·Granted Nov 5, 2019·1 cites·24 claims
- 0767US10472728B2Copper foil for printed circuitJX NIPPON MINING & METALS CORP·Filed 2016·Granted Nov 12, 2019·0 cites·26 claims
- 0863US10383222B2Surface-treated copper foilJX NIPPON MINING & METALS CORP·Filed 2017·Granted Aug 13, 2019·0 cites·38 claims
- 0960US10529992B2Surface-treated copper foil, and current collector, electrode, and battery cell using the surface-treated copper foilJX NIPPON MINING & METALS CORP·Filed 2018·Granted Jan 7, 2020·0 cites·16 claims
- 1060US9049795B2Rolled copper or copper-alloy foil provided with roughened surfaceARAI HIDETA·Filed 2012·Granted Jun 2, 2015·0 cites·17 claims
- 1153US10925170B2Surface treated copper foil, surface treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic deviceJX NIPPON MINING & METALS CORP·Filed 2018·Granted Feb 16, 2021·0 cites·25 claims
- 1253US9730332B2Surface treated copper foil and laminate using the same, printed wiring board, and copper clad laminateJX NIPPON MINING & METALS CORP·Filed 2013·Granted Aug 8, 2017·0 cites·20 claims
- 1352US10820414B2Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic deviceJX NIPPON MINING & METALS CORP·Filed 2017·Granted Oct 27, 2020·0 cites·24 claims
- 1452US9580829B2Copper foil for printed circuitARAI HIDETA·Filed 2011·Granted Feb 28, 2017·0 cites·20 claims
- 1551US10791631B2Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic deviceJX NIPPON MINING & METALS CORP·Filed 2017·Granted Sep 29, 2020·0 cites·25 claims
- 1651US9232650B2Surface treated copper foil and laminate using the sameJX NIPPON MINING & METALS CORP·Filed 2013·Granted Jan 5, 2016·0 cites·12 claims
- 1750US10194534B2Printed wiring board, electronic device, catheter, and metallic materialJX NIPPON MINING & METALS CORP·Filed 2017·Granted Jan 29, 2019·0 cites·20 claims
- 1848US6319621B1Copper foil having glossy surface with excellent oxidation resistance and method of manufacturing the sameNIKKO MATERIALS CO LTD·Filed 1999·Granted Nov 20, 2001·11 cites·5 claims
- 1947US2016212836A1Surface-Treated Metal Material, Metal Foil With Carrier, Connector, Terminal, Laminate, Shielding Tape, Shielding Material, Printed Wiring Board, Processed Metal Member, Electronic Device, And Method For Manufacturing Printed Wiring BoardJX NIPPON MINING & METALS CORP·Filed 2014·Application pending·0 cites
- 2047US2016303829A1Surface Treated Copper Foil, Copper Clad Laminate, Printed Wiring Board, Electronic Apparatus and Method for Manufacturing Printed Wiring BoardJX NIPPON MINING & METALS CORP·Filed 2014·Application pending·0 cites
- 2145US2013011734A1Copper foil for negative electrode current collector of secondary batteryJX NIPPON MINING & METALS CORP·Filed 2011·Application pending·0 cites
- 2245US2018035529A1Structure having metal material for heat radiation, printed circuit board, electronic apparatus, and metal material for heat radiationJX NIPPON MINING & METALS CORP·Filed 2017·Application pending·0 cites
- 2344US2014057123A1Copper foil for printed circuitARAI HIDETA·Filed 2012·Application pending·0 cites
- 2438US2017347493A1Structure Having Metal Material For Heat Radiation, Printed Circuit Board, Electronic Apparatus, And Metal Material For Heat RadiationJX NIPPON MINING & METALS CORP·Filed 2017·Application pending·0 cites
- 2533US2013071652A1Laminate for flexible wiringYAMANISHI KEISUKE·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →