Inventor · disambiguated record
Hiroaki Chihaya
Also filed as: CHIHAYA HIROAKI
12 granted patents·24 citations·filing 2009–2022
84Inventor score
Top patents by PatentIndex Score
12 records- 0195US8804287B2Material for use in a TMR read gap without adversely affecting the TMR effectARAKI SATORU·Filed 2010·Granted Aug 12, 2014·16 cites·7 claims
- 0287US12170217B2Substrate processing apparatus and abnormality detection methodTOKYO ELECTRON LTD·Filed 2022·Granted Dec 17, 2024·1 cites·3 claims
- 0381US11939665B2Film thickness measuring apparatus and film thickness measuring method, and film forming system and film forming methodTOKYO ELECTRON LTD·Filed 2021·Granted Mar 26, 2024·1 cites·28 claims
- 0481US11542592B2Film forming system and method for forming film on substrateTOKYO ELECTRON LTD·Filed 2019·Granted Jan 3, 2023·1 cites·3 claims
- 0574US8254067B2Tunnel junction type magneto-resistive headNISHIOKA KOICHI·Filed 2009·Granted Aug 28, 2012·3 cites·14 claims
- 0672US10297278B2Material for use in a TMR read gap without adversely affecting the TMR effectHGST Netherlands BV·Filed 2014·Granted May 21, 2019·2 cites·20 claims
- 0756US12469723B2Substrate processing apparatus and abnormality detection methodTOKYO ELECTRON LTD·Filed 2022·Granted Nov 11, 2025·0 cites·6 claims
- 0853US10748750B2Substrate processing apparatusTOKYO ELECTRON LTD·Filed 2018·Granted Aug 18, 2020·0 cites·6 claims
- 0952US11715671B2Film forming system, magnetization characteristic measuring device, and film forming methodTOKYO ELECTRON LTD·Filed 2020·Granted Aug 1, 2023·0 cites·20 claims
- 1051US12387922B2Film forming apparatus, processing condition determination method, and film forming methodTOKYO ELECTRON LTD·Filed 2022·Granted Aug 12, 2025·0 cites·9 claims
- 1145US8867177B2Magnetic sensor having improved resistance to thermal stress induced instabilityARAKI SATORU·Filed 2010·Granted Oct 21, 2014·0 cites·22 claims
- 1244US12392026B2Method and device for substrate processingTOKYO ELECTRON LTD·Filed 2020·Granted Aug 19, 2025·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →