Inventor · disambiguated record
Hirohisa Dejima
Also filed as: DEJIMA HIROHISA
3 granted patents·8 pending applications·1 citations·filing 2008–2019
47Inventor score
Top patents by PatentIndex Score
11 records- 0150US7999354B2Resin composition, filling material, insulating layer and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2008·Granted Aug 16, 2011·1 cites·17 claims
- 0247US10613368B2Buffer sheet and flat panel displayKEIWA INC·Filed 2018·Granted Apr 7, 2020·0 cites·6 claims
- 0344US2011316116A1Photosensitive resin composition, adhesive film and light-receiving deviceSATO TOSHIHIRO·Filed 2010·Application pending·0 cites
- 0442US2012032284A1Film for resin spacer, light-receiving device and method for manufacturing same, and mems device and method for manufacturing sameDEJIMA HIROHISA·Filed 2010·Application pending·0 cites
- 0539US10718892B2Backlight unit and liquid crystal display deviceKEIWA INC·Filed 2019·Granted Jul 21, 2020·0 cites·4 claims
- 0636US2011316127A1Spacer formation film, semiconductor wafer and semiconductor deviceSHIRAISHI FUMIHIRO·Filed 2010·Application pending·0 cites
- 0732US2012168970A1Spacer formation film, method of manufacturing semiconductor wafer bonding product, semiconductor wafer bonding product and semiconductor deviceSATO TOSHIHIRO·Filed 2010·Application pending·0 cites
- 0831US2012012989A1Method of manufacturing semiconductor wafer bonding product, semiconductor wafer bonding product and semiconductor deviceSATO TOSHIHIRO·Filed 2010·Application pending·0 cites
- 0930US2012187553A1Method of manufacturing semiconductor wafer bonding product, semiconductor wafer bonding product and semiconductor deviceYONEYAMA MASAHIRO·Filed 2010·Application pending·0 cites
- 1029US2011304034A1Semiconductor wafer bonding product, method of manufacturing semiconductor wafer bonding product and semiconductor deviceDEJIMA HIROHISA·Filed 2010·Application pending·0 cites
- 1125US2012196075A1Resin composition, semiconductor wafer bonding product and semiconductor deviceTAKAHASHI TOYOSEI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →