Inventor · disambiguated record
Hironobu Fujimoto
Also filed as: FUJIMOTO HIRONOBU
7 granted patents·5 pending applications·40 citations·filing 2007–2023
81Inventor score
Top patents by PatentIndex Score
12 records- 0190US7875501B2Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structureSHINETSU POLYMER CO·Filed 2007·Granted Jan 25, 2011·19 cites·6 claims
- 0283US9534151B2Sheet and adhesive sheetFUJIMOTO HIRONOBU·Filed 2010·Granted Jan 3, 2017·9 cites·15 claims
- 0380US8182649B2Fixed jig, chip pickup method and chip pickup apparatusWATANABE KENICHI·Filed 2007·Granted May 22, 2012·7 cites·3 claims
- 0473US8212345B2Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structureTANAKA KIYOFUMI·Filed 2010·Granted Jul 3, 2012·4 cites·15 claims
- 0570US9023913B2Curable resin composition, curable resin molded body, cured resin molded body, method for producing each of same, and laminate bodyLINTEC CORP·Filed 2012·Granted May 5, 2015·1 cites·14 claims
- 0658US11884596B2Method for producing granules for ceramic productionTOKUYAMA CORP·Filed 2019·Granted Jan 30, 2024·0 cites·4 claims
- 0756US2025226229A1Workpiece Processing MethodLINTEC CORP·Filed 2023·Application pending·0 cites
- 0848US2014308494A1Gas barrier film, method for producing same, gas barrier film laminate, member for electronic devices, and electronic deviceLINTEC CORP·Filed 2012·Application pending·0 cites
- 0945US9102833B2Curable resin composition, curable resin molded body, cured resin molded body, method for producing each of same, and laminate bodyLINTEC CORP·Filed 2012·Granted Aug 11, 2015·0 cites·7 claims
- 1044US2010289283A1Chip Pickup Method and Chip Pickup ApparatusLINTEC CORP·Filed 2007·Application pending·0 cites
- 1140US2015303093A1Adhesive SheetLINTEC CORP·Filed 2013·Application pending·0 cites
- 1239US2015111032A1Film, Sheet Substrate for Processing Workpiece, and Sheet for Processing WorkpieceLINTEC CORP·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →