Inventor · disambiguated record
Hirofumi Hajime
Also filed as: HAJIME HIROFUMI
7 granted patents·1 pending application·161 citations·filing 1996–2007
87Inventor score
Top patents by PatentIndex Score
8 records- 0178US5821166AMethod of manufacturing semiconductor wafersKOMATSU DENSHI KINZOKU KK·Filed 1996·Granted Oct 13, 1998·56 cites·4 claims
- 0268US5899743AMethod for fabricating semiconductor wafersKOMATSU DENSHI KINZOKU KK·Filed 1996·Granted May 4, 1999·36 cites·2 claims
- 0361US6162730AMethod for fabricating semiconductor wafersKOMATSU DENSHI KINZOKU KK·Filed 1999·Granted Dec 19, 2000·26 cites·10 claims
- 0454US5756399AProcess for making semiconductor waferKOMATSU DENSHI KINZOKU KK·Filed 1997·Granted May 26, 1998·20 cites·3 claims
- 0542US5880027AProcess for fabricating semiconductor waferKOMATSU DENSHI KINZOKU KK·Filed 1997·Granted Mar 9, 1999·10 cites·8 claims
- 0642US5873772AMethod for polishing the top and bottom of a semiconductor wafer simultaneouslyKOMATSU DENSHI KINZOKU KK·Filed 1997·Granted Feb 23, 1999·10 cites·4 claims
- 0734US2010031989A1Thermoelectric module and metallized substrateKELK LTD·Filed 2007·Application pending·0 cites
- 0833US5747364AMethod of making semiconductor wafers and semiconductor wafers made therebyKOMATSU DENSHI KINZOKU KK·Filed 1997·Granted May 5, 1998·3 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →