Inventor · disambiguated record
Hiroki Hatta
Also filed as: HATTA HIROKI
4 granted patents·8 pending applications·1 citations·filing 2017–2025
57Inventor score
Top patents by PatentIndex Score
12 records- 0179US11753716B2Method of processing substrate, substrate processing apparatus, recording medium, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2020·Granted Sep 12, 2023·1 cites·14 claims
- 0269US2025305125A1Substrate processing apparatus and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0361US12435423B2Substrate processing method, method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Oct 7, 2025·0 cites·19 claims
- 0461US2025340993A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0560US2025014894A1Substrate Processing Method, Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Non-transitory Computer-readable Recording MediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0660US2023193465A1Substrate processing method, method of manufacturing semiconductor device and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 0758US12359314B2Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jul 15, 2025·0 cites·17 claims
- 0857US2025343029A1Substrate processing apparatus, gas supply structure, method of processing substrate, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0955US2023411145A1Processing method, method of manufacturing semiconductor device, processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1054US2025215568A1Substrate Processing Apparatus, Gas Supply Assembly, Substrate Processing Method, Method of Manufacturing Semiconductor Device and Non-transitory Computer-Readable Recording MediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1142US10290492B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted May 14, 2019·0 cites·18 claims
- 1233US2018171467A1Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Non-Transitory Computer-Readable Recording MediumHITACHI INT ELECTRIC INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →