Inventor · disambiguated record
Hirokazu Hayashi
Also filed as: HAYASHI HIROKAZU
27 granted patents·15 pending applications·212 citations·filing 1989–2025
95Inventor score
Files withOKI ELECTRIC IND CO LTD14OKI SEMICONDUCTOR CO LTD5TOKYO SEIMITSU CO LTD4HAYASHI HIROKAZU3MURATA MANUFACTURING CO3
Top patents by PatentIndex Score
42 records- 0185US9543596B2Seal member for fuel cell and fuel cell seal body using sameSUMITOMO RIKO CO LTD·Filed 2015·Granted Jan 10, 2017·2 cites·12 claims
- 0283US5452019AProjected image displaying apparatus and a method of correcting color unevenness thereinSHARP KK·Filed 1993·Granted Sep 19, 1995·67 cites·6 claims
- 0377US7434179B2Design and simulation methods for electrostatic protection circuitsOKI ELECTRIC IND CO LTD·Filed 2005·Granted Oct 7, 2008·8 cites·6 claims
- 0474US7498615B2Electro-static discharge protection circuit and semiconductor device having the sameOKI ELECTRIC IND CO LTD·Filed 2006·Granted Mar 3, 2009·6 cites·18 claims
- 0574US7302378B2Electrostatic discharge protection device modeling method and electrostatic discharge simulation methodOKI ELECTRIC IND CO LTD·Filed 2004·Granted Nov 27, 2007·19 cites·8 claims
- 0671US7859063B2Semiconductor device using SOI-substrateOKI SEMICONDUCTOR CO LTD·Filed 2008·Granted Dec 28, 2010·4 cites·2 claims
- 0770US7729096B2Semiconductor integrated circuitOKI SEMICONDUCTOR CO LTD·Filed 2008·Granted Jun 1, 2010·4 cites·12 claims
- 0870US6277684B1Method of fabricating a SOI structure semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2000·Granted Aug 21, 2001·12 cites·27 claims
- 0970US2025018501A1Method and device for adjusting optical axis of laser lightTOKYO SEIMITSU CO LTD·Filed 2024·Application pending·0 cites
- 1068US2025018504A1Laser optical system and adjustment method therefor, and laser machining device and methodTOKYO SEIMITSU CO LTD·Filed 2024·Application pending·0 cites
- 1168US2025375837A1Laser machining deviceTOKYO SEIMITSU CO LTD·Filed 2025·Application pending·0 cites
- 1265US6566712B2SOI structure semiconductor device and a fabrication method thereofOKI ELECTRIC IND CO LTD·Filed 2001·Granted May 20, 2003·9 cites·10 claims
- 1364US6594625B2Method for modeling diffusion of impurities in a semiconductorOKI ELECTRIC IND CO LTD·Filed 2001·Granted Jul 15, 2003·10 cites·24 claims
- 1461US8159033B2ESD protection device and manufacturing method thereofHAYASHI HIROKAZU·Filed 2009·Granted Apr 17, 2012·3 cites·14 claims
- 1561US7268003B2Method of evaluating semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2004·Granted Sep 11, 2007·7 cites·11 claims
- 1660US7671415B2Electro-static discharge protection circuit and semiconductor device having the sameOKI SEMICONDUCTOR CO LTD·Filed 2006·Granted Mar 2, 2010·2 cites·16 claims
- 1759US12247330B2Cylindrical structureMURATA MANUFACTURING CO·Filed 2022·Granted Mar 11, 2025·0 cites·13 claims
- 1859US8414753B2Method for forming coating filmOKADA EISAKU·Filed 2009·Granted Apr 9, 2013·1 cites·14 claims
- 1957US2022364277A1Yarn and fabricMURATA MANUFACTURING CO·Filed 2022·Application pending·0 cites
- 2057US2022235496A1ThreadMURATA MANUFACTURING CO·Filed 2022·Application pending·0 cites
- 2156US2008147458A1Breeding support systemOKI ELECTRIC IND CO LTD·Filed 2007·Application pending·0 cites
- 2254US6581028B1Profile extraction method and profile extraction apparatusOKI ELECTRIC IND CO LTD·Filed 1999·Granted Jun 17, 2003·29 cites·19 claims
- 2354US2020327612A1Currency exchange system and remittance systemATOM SOLUTIONS CO LTD·Filed 2018·Application pending·0 cites
- 2454US2014287340A1Rubber composition and fuel cell sealed bodyTOKAI RUBBER IND LTD·Filed 2014·Application pending·0 cites
- 2553US5089101ACationic electrodeposition coating compositionKANSAI PAINT CO LTD·Filed 1991·Granted Feb 18, 1992·14 cites·20 claims
- 2653US2023264292A1Laser machining apparatus and laser machining methodTOKYO SEIMITSU CO LTD·Filed 2023·Application pending·0 cites
- 2752US7000201B2Evaluation TEG for semiconductor device and method of evaluationOKI ELECTRIC IND CO LTD·Filed 2004·Granted Feb 14, 2006·3 cites·11 claims
- 2851US4904361AElectrodeposition coating compositionKANSAI PAINT CO LTD·Filed 1989·Granted Feb 27, 1990·12 cites·13 claims
- 2950USRE40597EEvaluation TEG for semiconductor device and method of evaluationOKI ELECTRIC IND CO LTD·Filed 2006·Granted Dec 2, 2008·0 cites·17 claims
- 3045US6981236B2Method for modeling semiconductor device and networkOKI ELECTRIC IND CO LTD·Filed 2003·Granted Dec 27, 2005·0 cites·6 claims
- 3145US2008020173A1Polyester Pile Fabric Having Excellent Soft Hand, Abrasion Resistance And Bathochromic EffectTEIJIN FIBERS LTD·Filed 2005·Application pending·0 cites
- 3242US7197439B2Method for modeling semiconductor device processOKI ELECTRIC IND CO LTD·Filed 2002·Granted Mar 27, 2007·0 cites·2 claims
- 3341US7723794B2Load driving deviceOKI SEMICONDUCTOR CO LTD·Filed 2006·Granted May 25, 2010·0 cites·10 claims
- 3441US7521713B2Semiconductor device having electrostatic discharge elementOKI SEMICONDUCTOR CO LTD·Filed 2005·Granted Apr 21, 2009·0 cites·13 claims
- 3540US9957611B2Removal device for semiconductor manufacturing apparatus and semiconductor manufacturing apparatusTOSHIBA KK·Filed 2016·Granted May 1, 2018·0 cites·8 claims
- 3638US9617650B2Cationic electrodeposition coating composition and coated articleOKADA EISAKU·Filed 2012·Granted Apr 11, 2017·0 cites·2 claims
- 3738US2007122585A1Pile fabric and method for producing the sameFUKURO TADAYUKI·Filed 2004·Application pending·0 cites
- 3836US2005275030A1Semiconductor device and method of manufacturing the sameOKI ELECTRIC IND CO LTD·Filed 2004·Application pending·0 cites
- 3935US11291373B2Deep-body-temperature estimation system, heat stress warning system, and deep-body-temperature estimation methodTEIJIN LTD·Filed 2018·Granted Apr 5, 2022·0 cites·13 claims
- 4034US2013221498A1Semiconductor device and method for manufacturing the sameHAYASHI HIROKAZU·Filed 2012·Application pending·0 cites
- 4134US2007215231A1Pile Fabric And Method For Producing The SameHAYASHI HIROKAZU·Filed 2005·Application pending·0 cites
- 4231US2019122517A1Article provided with warning systemTEIJIN LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →