Inventor · disambiguated record
Hirokazu Honda
Also filed as: HONDA HIROKAZU
34 granted patents·11 pending applications·792 citations·filing 1997–2015
98Inventor score
Top patents by PatentIndex Score
45 records- 0198US6406942B2Flip chip type semiconductor device and method for manufacturing the sameNEC CORP·Filed 2001·Granted Jun 18, 2002·154 cites·8 claims
- 0297US7397000B2Wiring board and semiconductor package using the sameNEC CORP·Filed 2005·Granted Jul 8, 2008·54 cites·18 claims
- 0394US8008130B2Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semicondutor chip on the interconnection boardRENESAS ELECTRONICS CORP·Filed 2007·Granted Aug 30, 2011·26 cites·19 claims
- 0491US7566834B2Wiring board and semiconductor package using the sameNEC CORP·Filed 2008·Granted Jul 28, 2009·17 cites·11 claims
- 0591US7217999B1Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semiconductor chip on the interconnection boardNEC ELECTRONICS CORP·Filed 2000·Granted May 15, 2007·46 cites·14 claims
- 0690US6696764B2Flip chip type semiconductor device and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2003·Granted Feb 24, 2004·50 cites·37 claims
- 0789US9368474B2Manufacturing method for semiconductor deviceJ DEVICES CORP·Filed 2015·Granted Jun 14, 2016·8 cites·21 claims
- 0889US8324718B2Warp-suppressed semiconductor deviceHONDA HIROKAZU·Filed 2010·Granted Dec 4, 2012·15 cites·12 claims
- 0989US8198140B2Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor packageMURAI HIDEYA·Filed 2010·Granted Jun 12, 2012·14 cites·12 claims
- 1089US7728440B2Warp-suppressed semiconductor deviceNEC ELECTRONICS CORP·Filed 2004·Granted Jun 1, 2010·47 cites·20 claims
- 1189US6611063B1Resin-encapsulated semiconductor deviceNEC ELECTRONICS CORP·Filed 2000·Granted Aug 26, 2003·89 cites·1 claims
- 1287US7838779B2Wiring board, method for manufacturing same, and semiconductor packageNEC CORP·Filed 2006·Granted Nov 23, 2010·16 cites·11 claims
- 1386US9635762B2Semiconductor packageJ-DEVICES CORP·Filed 2015·Granted Apr 25, 2017·6 cites·11 claims
- 1485US8304905B2Semiconductor deviceMATSUI SATOSHI·Filed 2011·Granted Nov 6, 2012·9 cites·14 claims
- 1585US6445062B1Semiconductor device having a flip chip cavity with lower stress and method for forming sameNEC CORP·Filed 2000·Granted Sep 3, 2002·40 cites·31 claims
- 1684US7348673B2Semiconductor deviceNEC CORP·Filed 2005·Granted Mar 25, 2008·13 cites·34 claims
- 1783US7233066B2Multilayer wiring substrate, and method of producing sameNEC ELECTRONICS CORP·Filed 2006·Granted Jun 19, 2007·8 cites·7 claims
- 1882US6734566B2Recyclable flip-chip semiconductor deviceNEC ELECTRONICS CORP·Filed 2001·Granted May 11, 2004·28 cites·7 claims
- 1981US6723627B1Method for manufacturing semiconductor devicesNEC CORP·Filed 2000·Granted Apr 20, 2004·42 cites·13 claims
- 2080US9117814B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Aug 25, 2015·4 cites·13 claims
- 2180US7911038B2Wiring board, semiconductor device using wiring board and their manufacturing methodsRENESAS ELECTRONICS CORP·Filed 2007·Granted Mar 22, 2011·7 cites·18 claims
- 2280US7060604B2Multilayer wiring substrate, and method of producing sameNEC ELECTRONICS CORP·Filed 2003·Granted Jun 13, 2006·21 cites·32 claims
- 2376US10098179B2Electronic deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Oct 9, 2018·4 cites·23 claims
- 2474US7138064B2Semiconductor device and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2003·Granted Nov 21, 2006·17 cites·19 claims
- 2572US7816782B2Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor packageNEC CORP·Filed 2005·Granted Oct 19, 2010·4 cites·21 claims
- 2671US7074650B2Flip-chip type semiconductor device and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2004·Granted Jul 11, 2006·15 cites·12 claims
- 2769US7498249B2Method of forming a connecting conductor and wirings of a semiconductor chipNEC ELECTRONICS CORP·Filed 2006·Granted Mar 3, 2009·6 cites·5 claims
- 2865US6696317B1Method of manufacturing a flip-chip semiconductor device with a stress-absorbing layer made of thermosetting resinNEC ELECTRONICS CORP·Filed 2000·Granted Feb 24, 2004·11 cites·7 claims
- 2964US9362262B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Jun 7, 2016·1 cites·14 claims
- 3063US7674989B2Wiring board and method for manufacturing the sameNEC ELECTRONICS CORP·Filed 2006·Granted Mar 9, 2010·2 cites·23 claims
- 3162US9362200B2Heat sink in the aperture of substrateJ DEVICES CORP·Filed 2015·Granted Jun 7, 2016·1 cites·20 claims
- 3258US6767761B2Method of manufacturing a flip-chip semiconductor device with a stress-absorbing layer made of thermosetting resinNEC ELECTRONICS CORP·Filed 2003·Granted Jul 27, 2004·7 cites·1 claims
- 3356US2009017613A1Method of manufacturing interconnect substrate and semiconductor deviceNEC ELECTRONICS CORP·Filed 2008·Application pending·0 cites
- 3454US8389414B2Method of manufacturing a wiring boardKIKUCHI KATSUMI·Filed 2011·Granted Mar 5, 2013·0 cites·30 claims
- 3552US2007178686A1Interconnect substrate, semiconductor device, and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 3649US2008203564A1Semiconductor device having stress alleviating portion positioned at outer circumference of chip, wiring substrate, and method for producing the sameNEC ELECTRONICS CORP·Filed 2008·Application pending·0 cites
- 3747US2009046441A1Wiring board for mounting semiconductor device, manufacturing method of the same, and wiring board assemblyNEC CORP·Filed 2006·Application pending·0 cites
- 3845US2010232127A1Wiring board composite body, semiconductor device, and method for manufacturing the wiring board composite body and the semiconductor deviceNEC ELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 3942US5704593AFilm carrier tape for semiconductor package and semiconductor device employing the sameNEC CORP·Filed 1997·Granted Jan 6, 1998·10 cites·6 claims
- 4041US2002121689A1Flip chip type semiconductor device and method for manufacturing the sameNEC CORP·Filed 2002·Application pending·0 cites
- 4140US2004089470A1Printed circuit board, semiconductor package, base insulating film, and manufacturing method for interconnect substrateNEC CORP·Filed 2003·Application pending·0 cites
- 4236US2002064935A1Semiconductor device and manufacturing method the sameFiled 2002·Application pending·0 cites
- 4336US2002063331A1Film carrier semiconductor deviceFiled 2000·Application pending·0 cites
- 4434US2004154163A1Method of forming a connecting conductor and wirings of a semiconductor chipFiled 2004·Application pending·0 cites
- 4534US2011079418A1Ceramic wiring board and method of manufacturing thereofIBIDEN CO LTD·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →