Inventor · disambiguated record
Hiroto Igawa
Also filed as: IGAWA HIROTO
10 granted patents·8 pending applications·2 citations·filing 2008–2024
78Inventor score
Top patents by PatentIndex Score
18 records- 0178US11664275B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted May 30, 2023·1 cites·9 claims
- 0278US11145491B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Oct 12, 2021·1 cites·16 claims
- 0377US12154826B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Nov 26, 2024·0 cites·18 claims
- 0476US2025022753A1Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0556US2024243019A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0656US2024194476A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0755US12040161B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Jul 16, 2024·0 cites·13 claims
- 0854US11908682B2Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 0951US2023201889A1Cleaning method, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1050US2023097621A1Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1150US2009017204A1Die coater and die coater adjustment method, as well as method of manufacturing optical filmNITTO DENKO CORP·Filed 2008·Application pending·0 cites
- 1248US2022301863A1Method of manufacturing semiconductor device, method of processing substrate, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1347US11081362B2Method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Aug 3, 2021·0 cites·17 claims
- 1447US10796900B2Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Oct 6, 2020·0 cites·15 claims
- 1546US2022139675A1Method of Manufacturing Semiconductor Device, Substrate Processing Method, Non-transitory Computer-readable Recording Medium and Substrate Processing ApparatusKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1644US9831249B2Method of manufacturing semiconductor device and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Nov 28, 2017·0 cites·17 claims
- 1743US11189483B2Method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Nov 30, 2021·0 cites·8 claims
- 1842US11152476B2Method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2018·Granted Oct 19, 2021·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →