Inventor · disambiguated record
Hidekazu Iida
Also filed as: IIDA HIDEKAZU
9 granted patents·1 pending application·53 citations·filing 1988–2022
78Inventor score
Top patents by PatentIndex Score
10 records- 0185US4987180ASilicone-based fabric finishing agentSHINETSU CHEMICAL CO·Filed 1988·Granted Jan 22, 1991·52 cites·16 claims
- 0266US10175588B2Decompression processing apparatusDISCO CORP·Filed 2017·Granted Jan 8, 2019·1 cites·1 claims
- 0357US12296777B2Vehicle occupant restraining system comprising a passenger airbagZF AUTOMOTIVE GERMANY GMBH·Filed 2022·Granted May 13, 2025·0 cites·10 claims
- 0444US11456213B2Processing method of waferDISCO CORP·Filed 2020·Granted Sep 27, 2022·0 cites·3 claims
- 0544US10957593B2Method of processing a waferDISCO CORP·Filed 2019·Granted Mar 23, 2021·0 cites·7 claims
- 0643US10790193B2Wafer processing methodDISCO CORP·Filed 2019·Granted Sep 29, 2020·0 cites·4 claims
- 0742US10896836B2Electrostatic chuckDISCO CORP·Filed 2018·Granted Jan 19, 2021·0 cites·8 claims
- 0842US10790192B2Wafer processing methodDISCO CORP·Filed 2019·Granted Sep 29, 2020·0 cites·4 claims
- 0936US9812292B2Etching methodDISCO CORP·Filed 2015·Granted Nov 7, 2017·0 cites·1 claims
- 1032US2016276199A1Decompression processing apparatusDISCO CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →