Inventor · disambiguated record
Hiroyasu Iimori
Also filed as: IIMORI HIROYASU
15 granted patents·15 pending applications·108 citations·filing 2003–2024
91Inventor score
Technology areasH10P
Top patents by PatentIndex Score
30 records- 0195US7838425B2Method of treating surface of semiconductor substrateTOSHIBA KK·Filed 2008·Granted Nov 23, 2010·27 cites·9 claims
- 0295US7749909B2Method of treating a semiconductor substrateTOSHIBA KK·Filed 2009·Granted Jul 6, 2010·46 cites·24 claims
- 0392US7985683B2Method of treating a semiconductor substrateTOSHIBA KK·Filed 2010·Granted Jul 26, 2011·13 cites·30 claims
- 0490US9213242B2Substrate processing method and substrate processing apparatusUOZUMI YOSHIHIRO·Filed 2012·Granted Dec 15, 2015·9 cites·23 claims
- 0576US11921428B2Substrate processing method and substrate processing apparatusKIOXIA CORP·Filed 2022·Granted Mar 5, 2024·0 cites·6 claims
- 0672US12512335B2Substrate processing apparatus, substrate processing method, and method of manufacturing semiconductor deviceKIOXIA CORP·Filed 2023·Granted Dec 30, 2025·0 cites·5 claims
- 0772US7776756B1Etching apparatus, a method of controlling an etching solution, and a method of manufacturing a semiconductor deviceTOSHIBA KK·Filed 2007·Granted Aug 17, 2010·3 cites·7 claims
- 0871US10453729B2Substrate treatment apparatus and substrate treatment methodTOSHIBA MEMORY CORP·Filed 2018·Granted Oct 22, 2019·1 cites·12 claims
- 0963US7727871B2Manufacturing method of semiconductor device using etching solutionTOSHIBA KK·Filed 2007·Granted Jun 1, 2010·1 cites·9 claims
- 1062US2019214277A1Substrate processing method and substrate processing apparatusTOSHIBA MEMORY CORP·Filed 2019·Application pending·0 cites
- 1160US2025183061A1Semiconductor manufacturing apparatus and method of manufacturing semiconductor deviceKIOXIA CORP·Filed 2024·Application pending·0 cites
- 1259US2025285890A1Semiconductor manufacturing device and method of manufacturing semiconductor deviceKIOXIA CORP·Filed 2024·Application pending·0 cites
- 1358US9514952B2Method of manufacturing semiconductor device and semiconductor manufacturing apparatusTOSHIBA KK·Filed 2015·Granted Dec 6, 2016·1 cites·15 claims
- 1456US7097784B2Etching method and apparatus for semiconductor wafersTOSHIBA KK·Filed 2003·Granted Aug 29, 2006·4 cites·7 claims
- 1556US2009317980A1Filter, substrate treatment apparatus and substrate treatment methodTOSHIBA KK·Filed 2009·Application pending·0 cites
- 1653US7267742B2Etching apparatus, a method of controlling an etching solution, and a method of manufacturing a semiconductor deviceTOSHIBA KK·Filed 2004·Granted Sep 11, 2007·3 cites·8 claims
- 1752US11508574B2Semiconductor manufacturing apparatus and manufacturing method of semiconductor deviceKIOXIA CORP·Filed 2020·Granted Nov 22, 2022·0 cites·4 claims
- 1852US2008308132A1Semiconductor substrate cleaning method using bubble/chemical mixed cleaning liquidTOMITA HIROSHI·Filed 2008·Application pending·0 cites
- 1950US2006255014A1Etching method and apparatus for semiconductor wafersTOSHIBA KK·Filed 2006·Application pending·0 cites
- 2048US2010044343A1Substrate treatment apparatus and substrate treatment methodTOMITA HIROSHI·Filed 2009·Application pending·0 cites
- 2147US2023072887A1Semiconductor manufacturing apparatus and method of manufacturing semiconductor deviceKIOXIA CORP·Filed 2022·Application pending·0 cites
- 2247US2005211378A1Filter, substrate treatment apparatus and substrate treatment methodIIMORI HIROYASU·Filed 2005·Application pending·0 cites
- 2346US2011088731A1Semiconductor substrate cleaning method using bubble/chemical mixed cleaning liquidTOSHIBA KK·Filed 2010·Application pending·0 cites
- 2444US2008064212A1Method of manufacturing semiconductor deviceOGAWA YOSHIHIRO·Filed 2007·Application pending·0 cites
- 2542US2006081335A1Semiconductor substrate processing apparatus and semiconductor device fabrication methodIIMORI HIROYASU·Filed 2005·Application pending·0 cites
- 2642US2009250431A1Substrate processing apparatus and substrate processing methodINUKAI MINAKO·Filed 2009·Application pending·0 cites
- 2741US10290490B2Dust collecting apparatus, substrate processing system, and method of manufacturing semiconductor deviceTOSHIBA MEMORY CORP·Filed 2016·Granted May 14, 2019·0 cites·17 claims
- 2841US2013273744A1Substrate processing method and substrate processing apparatusTOSHIBA KK·Filed 2013·Application pending·0 cites
- 2938US2018233383A1Substrate treatment apparatus and manufacturing method of semiconductor deviceTOSHIBA MEMORY CORP·Filed 2017·Application pending·0 cites
- 3035US10199209B2Substrate treatment apparatus and substrate treatment methodTOSHIBA MEMORY CORP·Filed 2016·Granted Feb 5, 2019·0 cites·6 claims
Join the waitlist — get patent alerts
Get an alert when Hiroyasu Iimori files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →