Inventor · disambiguated record
Hiroshi Ikakura
Also filed as: IKAKURA HIROSHI
18 granted patents·3 pending applications·326 citations·filing 1999–2025
94Inventor score
Top patents by PatentIndex Score
21 records- 0194US6479409B2Fabrication of a semiconductor device with an interlayer insulating film formed from a plasma devoid of an oxidizing agentCANON SALES CO INC·Filed 2001·Granted Nov 12, 2002·74 cites·20 claims
- 0293US8773558B2Photoelectric conversion element, and photoelectric conversion apparatus and image sensing systemKATO TARO·Filed 2012·Granted Jul 8, 2014·9 cites·47 claims
- 0392US6514855B1Semiconductor device manufacturing method having a porous insulating filmCANON SALES CO INC·Filed 2000·Granted Feb 4, 2003·77 cites·20 claims
- 0487US10008528B2Solid-state image sensor, method of manufacturing the same, and cameraCANON KK·Filed 2016·Granted Jun 26, 2018·5 cites·20 claims
- 0585US6642157B2Film forming method and semiconductor deviceCANON SALES CO INC·Filed 2000·Granted Nov 4, 2003·33 cites·20 claims
- 0684US9224777B2Solid-state image pickup device and method for manufacturing solid-state image pickup deviceSAWAYAMA TADASHI·Filed 2012·Granted Dec 29, 2015·4 cites·10 claims
- 0782US6852651B2Semiconductor device and method of manufacturing the sameCANON SALES CO INC·Filed 2001·Granted Feb 8, 2005·23 cites·23 claims
- 0880US6645883B2Film forming method, semiconductor device and manufacturing method of the sameCANON SALES CO INC·Filed 2001·Granted Nov 11, 2003·24 cites·14 claims
- 0978US9140603B2Photoelectric conversion element, and photoelectric conversion apparatus and image sensing systemCANON KK·Filed 2014·Granted Sep 22, 2015·1 cites·20 claims
- 1071US10998370B2Semiconductor device with insulating layers forming a bonding plane between first and second circuit components, method of manufacturing the same, and electronic deviceCANON KK·Filed 2019·Granted May 4, 2021·1 cites·14 claims
- 1170US6815824B2Semiconductor device and method of manufacturing the sameCANON SALES CO INC·Filed 2002·Granted Nov 9, 2004·10 cites·1 claims
- 1270US6255230B1Method for modifying a film forming surface of a substrate on which a film is to be formed, and method for manufacturing a semiconductor device using the sameCANON SALES CO INC·Filed 1999·Granted Jul 3, 2001·41 cites·13 claims
- 1366US9769401B2Solid-state imaging apparatus, method of manufacturing the same, and cameraCANON KK·Filed 2016·Granted Sep 19, 2017·1 cites·15 claims
- 1466US6630412B2Semiconductor device and method of manufacturing the sameCANON SALES CO INC·Filed 2001·Granted Oct 7, 2003·10 cites·18 claims
- 1560US2024313025A1Photoelectric conversion apparatus, photoelectric conversion system, and movable bodyCANON KK·Filed 2024·Application pending·0 cites
- 1659US6472334B2Film forming method, semiconductor device manufacturing method, and semiconductor deviceCANON SALES CO INC·Filed 2001·Granted Oct 29, 2002·6 cites·15 claims
- 1757US12166051B2Photoelectric conversion apparatus, method of manufacturing the same, and image capturing systemCANON KK·Filed 2021·Granted Dec 10, 2024·0 cites·19 claims
- 1857US2025294907A1Semiconductor apparatus and method for manufacturing semiconductor apparatusCANON KK·Filed 2025·Application pending·0 cites
- 1954US6911405B2Semiconductor device and method of manufacturing the sameSEMICONDUCTOR PROCESS LAB CO·Filed 2001·Granted Jun 28, 2005·4 cites·18 claims
- 2051US6649495B2Manufacturing method of semiconductor deviceCANON SALES CO INC·Filed 2002·Granted Nov 18, 2003·3 cites·11 claims
- 2138US2003104689A1Manufacturing method of semiconductor deviceCANON SALES CO INC AND SEMICON·Filed 2002·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hiroshi Ikakura files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →