Inventor · disambiguated record
Hisashi Ishida
Also filed as: ISHIDA HISASHI
44 granted patents·5 pending applications·1,195 citations·filing 1987–2019
98Inventor score
Top patents by PatentIndex Score
49 records- 0197US4764804ASemiconductor device and process for producing the sameHITACHI LTD·Filed 1987·Granted Aug 16, 1988·236 cites·5 claims
- 0295US7791890B2Computer systemNEC CORP·Filed 2006·Granted Sep 7, 2010·44 cites·18 claims
- 0394US7663285B2Brushless motorHONDA MOTOR CO LTD·Filed 2008·Granted Feb 16, 2010·30 cites·2 claims
- 0492US5471967ADisc discharging toyTOYBOX CORP·Filed 1994·Granted Dec 5, 1995·118 cites·18 claims
- 0591US6117347AMethod of separating wafers into individual dieNEC CORP·Filed 1997·Granted Sep 12, 2000·116 cites·5 claims
- 0690US7732969B2Brushless motorHONDA MOTOR CO LTD·Filed 2008·Granted Jun 8, 2010·20 cites·2 claims
- 0784US5611322ADisc discharging toyTOYBOX CORP·Filed 1995·Granted Mar 18, 1997·72 cites·11 claims
- 0880US5360988ASemiconductor integrated circuit device and methods for production thereofHITACHI LTD·Filed 1992·Granted Nov 1, 1994·61 cites·14 claims
- 0979US6227894B1Insertion and withdrawal connector apparatus, structure of remote controlling engagement and separation thereof, and connecting frame block structure for insertion and withdrawal connector apparatus or the likeJAPAN AVIATION ELECTRON·Filed 2000·Granted May 8, 2001·14 cites·4 claims
- 1079US6217344B1Cable connector in which two contacts clamp a wire core of a cable therebetweenJAPAN AVIATION ELECTRON·Filed 2000·Granted Apr 17, 2001·25 cites·6 claims
- 1178US8106303B2Printed wiring board including a thermal land for supressing heat dissipationISHIDA HISASHI·Filed 2007·Granted Jan 31, 2012·7 cites·11 claims
- 1278US7884520B2Brushless motorMITSUBA CORP·Filed 2008·Granted Feb 8, 2011·9 cites·2 claims
- 1377US7816827B2Brushless motorHONDA MOTOR CO LTD·Filed 2008·Granted Oct 19, 2010·8 cites·3 claims
- 1476US9342649B2Rule check system, method, and non-transitory computer readable medium storing presentation programNEC CORP·Filed 2012·Granted May 17, 2016·3 cites·7 claims
- 1575US9313877B2Electronic device and noise suppression methodISHIDA HISASHI·Filed 2010·Granted Apr 12, 2016·3 cites·21 claims
- 1673US11207003B2Walking state determination device, walking state determination system, walking state determination method, and storage mediumNEC CORP·Filed 2017·Granted Dec 28, 2021·2 cites·7 claims
- 1773US5590461AMethod of making multi-layer wiring boardNEC CORP·Filed 1995·Granted Jan 7, 1997·38 cites·1 claims
- 1873US5426849AMethod of producing a polyimide multilayer wiring boardNEC CORP·Filed 1993·Granted Jun 27, 1995·48 cites·20 claims
- 1972US5795174AMulti-connector supporting device with connection/disconnection mechanismJAPAN AVIATION ELECTRON·Filed 1996·Granted Aug 18, 1998·32 cites·15 claims
- 2072US5628852AMethod for manufacturing a polyimide multilayer wiring substrateNEC CORP·Filed 1994·Granted May 13, 1997·46 cites·8 claims
- 2171US5321210APolyimide multilayer wiring board and method of producing sameNEC CORP·Filed 1992·Granted Jun 14, 1994·43 cites·26 claims
- 2269US5337466AMethod of making a multilayer printed wiring boardNEC CORP·Filed 1993·Granted Aug 16, 1994·35 cites·9 claims
- 2367US9536033B2Board design method and board design deviceNEC CORP·Filed 2013·Granted Jan 3, 2017·2 cites·20 claims
- 2467US5519658ASemiconductor integrated circuit device and methods for production thereofHITACHI LTD·Filed 1994·Granted May 21, 1996·34 cites·29 claims
- 2564US7781928B2Brushless motorHONDA MOTOR CO LTD·Filed 2008·Granted Aug 24, 2010·3 cites·2 claims
- 2664US6149447AInsertion and withdrawal connector apparatus, structure of remote controlling engagement and separation thereof, and connecting frame block structure for insertion and withdrawal connector apparatus or the likeJAPAN AVIATION ELECTRON·Filed 1998·Granted Nov 21, 2000·21 cites·4 claims
- 2764US5534666AMulti-layer wiring board having a base block and a stacking block connected by an adhesive layerNEC CORP·Filed 1994·Granted Jul 9, 1996·28 cites·8 claims
- 2863US10776945B2Dimension measurement device, dimension measurement system, and dimension measurement methodNEC CORP·Filed 2016·Granted Sep 15, 2020·1 cites·11 claims
- 2962US9027991B2Racing bucket seat and cooling system for racing car with the sameISHIDA HISASHI·Filed 2010·Granted May 12, 2015·6 cites·21 claims
- 3061US5686702APolyimide multilayer wiring substrateNIPPON ELECTRIC CO·Filed 1995·Granted Nov 11, 1997·22 cites·3 claims
- 3160US6626692B2Insertion and withdrawal connector apparatus, structure of remote controlling engagement and separation thereof, and connecting frame block structure for insertion and withdrawal connector apparatus or the likeJAPAN AVIATION ELECTRON·Filed 2002·Granted Sep 30, 2003·8 cites·1 claims
- 3258US5382757AMultilayer printed wiring board and process for manufacturing the sameNEC CORP·Filed 1991·Granted Jan 17, 1995·22 cites·3 claims
- 3357US7070444B2Cable connectorJAPAN AVIATION ELECTRON·Filed 2001·Granted Jul 4, 2006·10 cites·10 claims
- 3453US6165007ACable connector capable of reliably connecting a cable and a method of connecting the cable to the cable connectorJAPAN AVIATION ELECTRON·Filed 1999·Granted Dec 26, 2000·14 cites·7 claims
- 3552US8921711B2Wiring substrate and electronic deviceISHIDA HISASHI·Filed 2011·Granted Dec 30, 2014·0 cites·10 claims
- 3651US11890746B2Load reduction device, load reduction method, and storage medium storing programNEC CORP·Filed 2019·Granted Feb 6, 2024·0 cites·7 claims
- 3749US9830420B2Support device, design support method, and programNEC CORP·Filed 2014·Granted Nov 28, 2017·0 cites·10 claims
- 3848US9320141B2Wiring structure, cable, and method of manufacturing wiring structureISHIDA HISASHI·Filed 2010·Granted Apr 19, 2016·0 cites·19 claims
- 3947US6813830B2Method for connecting a cable to a cable connector having two contactsJAPAN AVIATION ELECTRON·Filed 2001·Granted Nov 9, 2004·4 cites·5 claims
- 4047US2009121566A1Brushless motorHONDA MOTOR CO LTD·Filed 2008·Application pending·0 cites
- 4145US6241539B1Connector driving apparatus for driving a plurality of connectors relatively to a plurality of mating connectorsJAPAN AVIATION ELECTRON·Filed 1999·Granted Jun 5, 2001·10 cites·6 claims
- 4245US2015286758A1Circuit simulation device, circuit simulation method, and programNEC CORP·Filed 2013·Application pending·0 cites
- 4343US2015005972A1Electric power system tree display system and electric power system tree display methodNEC CORP·Filed 2012·Application pending·0 cites
- 4442US2021203200A1Rotor for electric motor and brushless motorMITSUBA CORP·Filed 2017·Application pending·0 cites
- 4541US7049513B2Card-mounting rack for electronic part-mounting cardsNEC CORP·Filed 2003·Granted May 23, 2006·0 cites·9 claims
- 4640US8819613B2Power supply circuit design system and power supply circuit design methodOGAWA MASASHI·Filed 2011·Granted Aug 26, 2014·0 cites·11 claims
- 4739US9653416B2Semiconductor substrate and manufacturing method thereofOLYMPUS CORP·Filed 2016·Granted May 16, 2017·0 cites·10 claims
- 4836US6390844B2Insertion and withdrawal connector apparatus, structure of remote controlling engagement and separation thereof, and connecting frame block structure for insertion and withdrawal connector apparatus or the likeJAPAN AVIAT ELECTRONCIS INDUST·Filed 2001·Granted May 21, 2002·0 cites·2 claims
- 4933US2012217653A1Semiconductor device and noise suppressing methodTAKEMURA KOICHI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →