Inventor · disambiguated record
Hideaki Ishizawa
Also filed as: ISHIZAWA HIDEAKI
13 granted patents·4 pending applications·59 citations·filing 2001–2021
88Inventor score
Files withSEKISUI CHEMICAL CO LTD11HAYAKAWA AKINOBU2FUKUI HIROJI1KOBAYASHI HIROSHI1SEKISVI CHEMICAL CO LTD1
Top patents by PatentIndex Score
17 records- 0189US7915743B2Adhesive for electronic components, method for manufacturing semiconductor chip laminate, and semiconductor deviceSEKISUI CHEMICAL CO LTD·Filed 2007·Granted Mar 29, 2011·22 cites·17 claims
- 0286US7838577B2Adhesive for electronic componentSEKISUI CHEMICAL CO LTD·Filed 2008·Granted Nov 23, 2010·19 cites·8 claims
- 0380US8802989B2Conductive material and connection structureSEKISUI CHEMICAL CO LTD·Filed 2013·Granted Aug 12, 2014·2 cites·12 claims
- 0474US8119323B2Process for producing patterned film and photosensitive resin compositionFUKUI HIROJI·Filed 2006·Granted Feb 21, 2012·4 cites·8 claims
- 0571US7262231B2Photosensitive amine generator, photocurable composition and photoreactive adhesive compositionSEKISUI CHEMICAL CO LTD·Filed 2005·Granted Aug 28, 2007·1 cites·2 claims
- 0665US9446484B2Conductive particles, method for producing conductive particles, conductive material and connection structureSEKISUI CHEMICAL CO LTD·Filed 2013·Granted Sep 20, 2016·1 cites·10 claims
- 0763US9490046B2Conductive material and connected structureSEKISUI CHEMICAL CO LTD·Filed 2014·Granted Nov 8, 2016·1 cites·11 claims
- 0858US9928934B2Curable composition for electronic component and connection structureSEKISUI CHEMICAL CO LTD·Filed 2014·Granted Mar 27, 2018·0 cites·8 claims
- 0952US7012123B2Acrylic polymer and charge transport materialSEKISVI CHEMICAL CO LTD·Filed 2003·Granted Mar 14, 2006·7 cites·12 claims
- 1046US2013000964A1Anisotropic conductive material and connection structureKOBAYASHI HIROSHI·Filed 2011·Application pending·0 cites
- 1146US2023245936A1Laminate, curable resin composition, method for manufacturing laminate, method for manufacturing substrate having junction electrode, semiconductor device, and image capturing deviceSEKISUI CHEMICAL CO LTD·Filed 2021·Application pending·0 cites
- 1244US2010076119A1Adhesive for electronic componentsSEKISUI CHEMICAL CO LTD·Filed 2008·Application pending·0 cites
- 1341US6864300B2Photoreactive adhesive composition and method of bonding with the sameSEKISUI CHEMICAL CO LTD·Filed 2001·Granted Mar 8, 2005·0 cites·5 claims
- 1440US6641912B2Photocurable pressure-sensitive adhesive composition and its sheetSEKISUI CHEMICAL CO LTD·Filed 2001·Granted Nov 4, 2003·2 cites·20 claims
- 1538US2003166738A1Photosensitive amine generator, photocurable composition and photoreactive adhesive compositionFiled 2001·Application pending·0 cites
- 1630US8901207B2Adhesive for electronic componentsHAYAKAWA AKINOBU·Filed 2010·Granted Dec 2, 2014·0 cites·6 claims
- 1729US8563362B2Method of producing semiconductor chip laminate comprising an adhesive that comprises a curing compound, curing agent and spacer particlesHAYAKAWA AKINOBU·Filed 2010·Granted Oct 22, 2013·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →