Inventor · disambiguated record
Hiromichi Isogai
Also filed as: ISOGAI HIROMICHI
9 granted patents·3 pending applications·46 citations·filing 2002–2014
84Inventor score
Files withCOVALENT MATERIALS CORP3SENDA TAKESHI3TOSHIBA CERAMICS CO2BANBA HIRONORI1ISOGAI HIROMICHI1
Top patents by PatentIndex Score
12 records- 0177US7149341B2Wafer inspection apparatusSHIBAURA MECHATRONICS CORP·Filed 2003·Granted Dec 12, 2006·26 cites·15 claims
- 0272US8936679B2Single crystal pulling-up apparatus of pulling-up silicon single crystal and single crystal pulling-up method of pulling-up silicon single crystalBANBA HIRONORI·Filed 2011·Granted Jan 20, 2015·2 cites·20 claims
- 0369US7977219B2Manufacturing method for silicon waferCOVALENT MATERIALS CORP·Filed 2009·Granted Jul 12, 2011·3 cites·5 claims
- 0463US8476149B2Method of manufacturing single crystal silicon wafer from ingot grown by Czocharlski process with rapid heating/cooling processISOGAI HIROMICHI·Filed 2009·Granted Jul 2, 2013·3 cites·10 claims
- 0562US6668662B2Viscoelasticity measuring deviceTOSHIBA CERAMICS CO·Filed 2002·Granted Dec 30, 2003·5 cites·14 claims
- 0656US6976908B2Polishing head and polishing apparatusTOSHIBA CERAMICS CO·Filed 2004·Granted Dec 20, 2005·7 cites·11 claims
- 0744US2008164572A1Semiconductor substrate and manufacturing method thereofCOVALENT MATERIALS CORP·Filed 2007·Application pending·0 cites
- 0844US2009004825A1Method of manufacturing semiconductor substrateCOVALENT MATERIALS CORP·Filed 2008·Application pending·0 cites
- 0941US8252700B2Method of heat treating silicon waferSENDA TAKESHI·Filed 2010·Granted Aug 28, 2012·0 cites·8 claims
- 1039US8999864B2Silicon wafer and method for heat-treating silicon waferSENDA TAKESHI·Filed 2010·Granted Apr 7, 2015·0 cites·4 claims
- 1138US2016244358A1Quartz Glass Part and Fabrication Method for Quartz Glass PartTECHNO QUARTZ INC·Filed 2014·Application pending·0 cites
- 1234US8399341B2Method for heat treating a silicon waferSENDA TAKESHI·Filed 2010·Granted Mar 19, 2013·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →