Inventor · disambiguated record
Hiroyuki Izawa
Also filed as: IZAWA HIROYUKI
11 granted patents·13 pending applications·10 citations·filing 2001–2023
82Inventor score
Files withRESONAC CORP9HITACHI CHEMICAL CO LTD5KATOGI SHIGEKI4SHOWA DENKO MATERIALS CO LTD3IZAWA HIROYUKI2
Top patents by PatentIndex Score
24 records- 0165US2024352287A1Curable adhesive composition, filmy adhesive, method for producing multilayered wiring board, and multilayered wiring boardRESONAC CORP·Filed 2022·Application pending·0 cites
- 0261US12227683B2Connector production method and adhesive filmRESONAC CORP·Filed 2020·Granted Feb 18, 2025·0 cites·8 claims
- 0361US8138268B2Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor deviceKATOGI SHIGEKI·Filed 2005·Granted Mar 20, 2012·2 cites·13 claims
- 0459US8518303B2Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor deviceKATOGI SHIGEKI·Filed 2006·Granted Aug 27, 2013·2 cites·15 claims
- 0558US12285767B2Solder particle classifying method, solder particle, solder particle classifying system, adhesive composition, and adhesive filmRESONAC CORP·Filed 2022·Granted Apr 29, 2025·0 cites·8 claims
- 0658US7202283B2Method for dissolving saturated polyester solution for decomposing saturated polyester and method for decomposition using the sameHITACHI CHEMICAL CO LTD·Filed 2002·Granted Apr 10, 2007·5 cites·32 claims
- 0756US11242472B2Adhesive filmHITACHI CHEMICAL CO LTD·Filed 2018·Granted Feb 8, 2022·0 cites·11 claims
- 0855US2025282120A1Film, wound body, connection structure, and method for manufacturing connection structureRESONAC CORP·Filed 2022·Application pending·0 cites
- 0953US11935669B2Method for dispersing conductive particles, and electrostatic adsorption deviceRESONAC CORP·Filed 2020·Granted Mar 19, 2024·0 cites·9 claims
- 1053US2025159815A1Member for forming wiring, method for forming wiring layer using member for forming wiring, and formed wiring memberRESONAC CORP·Filed 2023·Application pending·0 cites
- 1153US2013140083A1Adhesive composition, film-like adhesive, adhesive sheet, circuit connection structure, method for connecting circuit members, use of adhesive composition, use of film-like adhesive and use of adhesive sheetHITACHI CHEMICAL CO LTD·Filed 2012·Application pending·0 cites
- 1253US2025142722A1Member for forming wiring, method for forming wiring layer using member for forming wiring, and formed wiring memberRESONAC CORP·Filed 2023·Application pending·0 cites
- 1352US11319466B2Adhesive filmHITACHI CHEMICAL CO LTD·Filed 2018·Granted May 3, 2022·0 cites·11 claims
- 1452US2025024609A1Wiring-forming member, wiring layer forming method using wiring-forming member, and wiring-formed memberRESONAC CORP·Filed 2022·Application pending·0 cites
- 1551US8309658B2Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor deviceKATOGI SHIGEKI·Filed 2011·Granted Nov 13, 2012·0 cites·10 claims
- 1650US2024079345A1Electroconductive member, method for manufacturing electronic device, connection structure, and electronic deviceSHOWA DENKO MATERIALS CO LTD·Filed 2022·Application pending·0 cites
- 1749US2024355665A1Adhesive sheet, production method for adhesive sheet, roll, and production method for connection structureRESONAC CORP·Filed 2022·Application pending·0 cites
- 1849US2023397337A1Method for manufacturing substrate with built-in components, and substrate with built-in componentsSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
- 1948US8696942B2Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor deviceKATOGI SHIGEKI·Filed 2012·Granted Apr 15, 2014·0 cites·13 claims
- 2047US2023328897A1Member for forming wiring, method for forming wiring layer using member for forming wiring, and wiring forming memberSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
- 2146US6780894B2Treatment liquid for cured unsaturated polyester resin and treatment method thereofHITACHI CHEMICAL CO LTD·Filed 2001·Granted Aug 24, 2004·1 cites·21 claims
- 2246US2012048332A1Adhesive film for solar cell electrode and method for manufacturing solar cell module using the sameSHIMIZU SHIGENORI·Filed 2011·Application pending·0 cites
- 2342US2012048606A1Adhesive composition, film-like adhesive, and connection structure for circuit memberIZAWA HIROYUKI·Filed 2008·Application pending·0 cites
- 2437US2013075142A1Adhesive composition, use thereof, connection structure for circuit members, and method for producing sameIZAWA HIROYUKI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →