Inventor · disambiguated record
Hirotaka Kato
Also filed as: KATO HIROTAKA
24 granted patents·7 pending applications·245 citations·filing 1996–2024
94Inventor score
Files withAUTONETWORKS TECHNOLOGIES LTD8KOMATSU DENSHI KINZOKU KK5SUMITOMO ELECTRIC INDUSTRIES4TOYOTA MOTOR CO LTD3SUMCO TECHXIV CORP2
Top patents by PatentIndex Score
31 records- 0192US9981581B2Vehicle seatTOYOTA BOSHOKU KK·Filed 2017·Granted May 29, 2018·12 cites·10 claims
- 0290US10220739B2Vehicle seatTOYOTA BOSHOKU KK·Filed 2017·Granted Mar 5, 2019·10 cites·12 claims
- 0390US5897743AJig for peeling a bonded waferKOMATSU DENSHI KINZOKU KK·Filed 1997·Granted Apr 27, 1999·80 cites·6 claims
- 0486US8021484B2Method of manufacturing epitaxial silicon wafer and apparatus thereforSUMCO TECHXIV CORP·Filed 2007·Granted Sep 20, 2011·9 cites·15 claims
- 0582US5932048AMethod of fabricating direct-bonded semiconductor wafersKOMATSU DENSHI KINZOKU KK·Filed 1997·Granted Aug 3, 1999·70 cites·3 claims
- 0667US11915843B2Multicore cableSUMITOMO ELECTRIC INDUSTRIES·Filed 2023·Granted Feb 27, 2024·0 cites·8 claims
- 0766US7993452B2Method of manufacturing epitaxial silicon waferSUMCO TECHXIV CORP·Filed 2007·Granted Aug 9, 2011·3 cites·6 claims
- 0866US2025069774A1Multicore cableSUMITOMO ELECTRIC INDUSTRIES·Filed 2022·Application pending·0 cites
- 0964US2025166867A1Multi-core cableSUMITOMO ELECTRIC INDUSTRIES·Filed 2024·Application pending·0 cites
- 1060US2024062929A1CableSUMITOMO ELECTRIC INDUSTRIES·Filed 2023·Application pending·0 cites
- 1157US12126156B2Fixing structure of wiring member, and wiring member with joint memberAUTONETWORKS TECHNOLOGIES LTD·Filed 2020·Granted Oct 22, 2024·0 cites·3 claims
- 1255US12261424B2Fixing structure of wiring member and wiring memberAUTONETWORKS TECHNOLOGIES LTD·Filed 2020·Granted Mar 25, 2025·0 cites·4 claims
- 1355US12009124B2Fixing structure of wiring member, and wiring member with heat generation layerAUTONETWORKS TECHNOLOGIES LTD·Filed 2020·Granted Jun 11, 2024·0 cites·6 claims
- 1454US12071081B2Wire harness routing deviceAUTONETWORKS TECHNOLOGIES LTD·Filed 2020·Granted Aug 27, 2024·0 cites·5 claims
- 1554US2006120828A1Book binding kitKATO HIROTAKA·Filed 2005·Application pending·0 cites
- 1653US11946758B2Route selection device and methodTOYOTA MOTOR CO LTD·Filed 2021·Granted Apr 2, 2024·0 cites·5 claims
- 1752US12012145B2Travel controller and method for travel controlTOYOTA MOTOR CO LTD·Filed 2021·Granted Jun 18, 2024·0 cites·4 claims
- 1852US11975662B2Wire harness and wire harness routing apparatusAUTONETWORKS TECHNOLOGIES LTD·Filed 2019·Granted May 7, 2024·0 cites·7 claims
- 1952US5948549ASinter joining method and sintered composite member produced by sameKOMATSU MFG CO LTD·Filed 1996·Granted Sep 7, 1999·12 cites·12 claims
- 2049US6250462B1Book-like disc casingTOKYO BIJUTSU SHIKOU JIGYOU KY·Filed 1999·Granted Jun 26, 2001·18 cites·4 claims
- 2149US5742176AMethod of measuring a Fe-B concentration of a silicon waferKOMATSU DENSHI KINZOKU KK·Filed 1996·Granted Apr 21, 1998·16 cites·4 claims
- 2248US11975663B2Wire harness routing apparatusAUTONETWORKS TECHNOLOGIES LTD·Filed 2020·Granted May 7, 2024·0 cites·4 claims
- 2347US12097810B2Wiring harness unit and wiring harness mounting structureAUTONETWORKS TECHNOLOGIES LTD·Filed 2019·Granted Sep 24, 2024·0 cites·4 claims
- 2447US2022352701A1Method of manufacturing wiring member-equipped adherend and wiring member-equipped adherendAUTONETWORKS TECHNOLOGIES LTD·Filed 2020·Application pending·0 cites
- 2542US2022063657A1Travel controller and method for travel controlTOYOTA MOTOR CO LTD·Filed 2021·Application pending·0 cites
- 2641US11955390B2Semiconductor wafer evaluation method and semiconductor wafer manufacturing methodSUMCO CORP·Filed 2019·Granted Apr 9, 2024·0 cites·7 claims
- 2740US2020359750A1TongueJOYSON SAFETY SYSTEMS JAPAN KK·Filed 2018·Application pending·0 cites
- 2839US8888913B2Method of manufacturing epitaxial silicon wafer and apparatus thereforNARAHARA KAZUHIRO·Filed 2011·Granted Nov 18, 2014·0 cites·21 claims
- 2938US5770511ASilicon-on-insulator substrate and a method for fabricating the sameKOMATSU DENSHI KINZOKU KK·Filed 1996·Granted Jun 23, 1998·7 cites·4 claims
- 3033US5849603AMethod of processing a surface of a semiconductor substrateKOMATSU DENSHI KINZOKU KK·Filed 1996·Granted Dec 15, 1998·3 cites·2 claims
- 3129US5742175AMethod of evaluating a density of oxygen-precipitation defects in a silicon waferKOMATSU ELECTRONIC METALS INC·Filed 1996·Granted Apr 21, 1998·5 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →