Inventor · disambiguated record
Hiromasa Kato
Also filed as: KATO HIROMASA
37 granted patents·18 pending applications·119 citations·filing 1991–2025
96Inventor score
Top patents by PatentIndex Score
55 records- 0191US12396092B2Ceramic circuit board and semiconductor device using sameTOSHIBA KK·Filed 2023·Granted Aug 19, 2025·1 cites·16 claims
- 0290US9357643B2Ceramic/copper circuit board and semiconductor deviceTOSHIBA KK·Filed 2014·Granted May 31, 2016·9 cites·14 claims
- 0389US8273993B2Electronic component moduleKATO HIROMASA·Filed 2007·Granted Sep 25, 2012·19 cites·11 claims
- 0488US12167534B2Method for manufacturing a ceramic copper circuit boardTOSHIBA KK·Filed 2021·Granted Dec 10, 2024·1 cites·8 claims
- 0587US10515868B2Circuit substrate and semiconductor deviceTOSHIBA KK·Filed 2017·Granted Dec 24, 2019·5 cites·21 claims
- 0686US12096954B2Endoscopic surgical toolOLYMPUS MEDICAL SYSTEMS CORP·Filed 2022·Granted Sep 24, 2024·1 cites·20 claims
- 0781US8785785B2Ceramic circuit board and process for producing sameKATO HIROMASA·Filed 2012·Granted Jul 22, 2014·6 cites·20 claims
- 0878US11013112B2Ceramic copper circuit board and semiconductor device based on the sameTOSHIBA KK·Filed 2019·Granted May 18, 2021·2 cites·19 claims
- 0978US10952317B2Ceramic circuit board and semiconductor moduleTOSHIBA KK·Filed 2020·Granted Mar 16, 2021·1 cites·17 claims
- 1077US9277639B2Semiconductor circuit board, semiconductor device using the same, and method for manufacturing semiconductor circuit boardTOSHIBA KK·Filed 2013·Granted Mar 1, 2016·4 cites·14 claims
- 1175US9101065B2Ceramic circuit board and process for producing sameTOSHIBA KK·Filed 2014·Granted Aug 4, 2015·3 cites·4 claims
- 1274US11973003B2Ceramic metal circuit board and semiconductor device using the sameTOSHIBA KK·Filed 2023·Granted Apr 30, 2024·0 cites·16 claims
- 1373US10595403B2Ceramic circuit board and semiconductor moduleTOSHIBA KK·Filed 2019·Granted Mar 17, 2020·1 cites·14 claims
- 1473US2024423657A1Endoscopic treatment deviceOLYMPUS MEDICAL SYSTEMS CORP·Filed 2024·Application pending·0 cites
- 1573US2025100059A1Heat treatment furnace apparatusTOSHIBA KK·Filed 2024·Application pending·0 cites
- 1673US2024407800A1Endoscopic surgical toolOLYMPUS MEDICAL SYSTEMS CORP·Filed 2024·Application pending·0 cites
- 1772US11653447B2Ceramic copper circuit board and method for manufacturing the sameTOSHIBA KK·Filed 2021·Granted May 16, 2023·0 cites·13 claims
- 1871US12508070B2Endoscope treatment toolOLYMPUS MEDICAL SYSTEMS CORP·Filed 2022·Granted Dec 30, 2025·0 cites·17 claims
- 1971US10872841B2Ceramic metal circuit board and semiconductor device using the sameTOSHIBA KK·Filed 2016·Granted Dec 22, 2020·2 cites·16 claims
- 2070US7482685B2Ceramic circuit board, method for making the same, and power moduleTOSHIBA KK·Filed 2004·Granted Jan 27, 2009·10 cites·13 claims
- 2169US11277911B2Ceramic copper circuit board and method for manufacturing the sameTOSHIBA KK·Filed 2020·Granted Mar 15, 2022·0 cites·8 claims
- 2269US10790214B2Circuit substrate and semiconductor deviceTOSHIBA KK·Filed 2019·Granted Sep 29, 2020·1 cites·11 claims
- 2369US9095051B2Ceramic substrate for mounting a device, ceramic substrate for mounting an LED, LED lamp, headlight and electronic partsFUKUDA YOSHIYUKI·Filed 2012·Granted Jul 28, 2015·2 cites·12 claims
- 2469US7927167B2Getter material and evaporable getter device using the same, and electron tubeTOSHIBA KK·Filed 2010·Granted Apr 19, 2011·1 cites·15 claims
- 2568US12108962B2Endoscopic treatment deviceOLYMPUS MEDICAL SYSTEMS CORP·Filed 2022·Granted Oct 8, 2024·0 cites·19 claims
- 2668US2025228601A1Endoscope treatment tool and treatment methodOLYMPUS CORP·Filed 2025·Application pending·0 cites
- 2768US2025228610A1Endoscope treatment toolOLYMPUS CORP·Filed 2025·Application pending·0 cites
- 2868US2025228609A1Endoscope treatment toolOLYMPUS CORP·Filed 2025·Application pending·0 cites
- 2967US10818565B2Circuit board and semiconductor moduleTOSHIBA KK·Filed 2019·Granted Oct 27, 2020·1 cites·12 claims
- 3066US8518554B2Ceramic metal composite and semiconductor device using the sameNABA TAKAYUKI·Filed 2007·Granted Aug 27, 2013·4 cites·7 claims
- 3166US2023390845A1Method For Manufacturing Ceramic Circuit BoardTOSHIBA KK·Filed 2023·Application pending·0 cites
- 3262US10160690B2Silicon nitride circuit board and semiconductor module using the sameTOSHIBA KK·Filed 2016·Granted Dec 25, 2018·1 cites·19 claims
- 3361US2024260182A1Ceramic copper circuit board and semiconductor device using sameTOSHIBA KK·Filed 2024·Application pending·0 cites
- 3460US11594467B2Ceramic metal circuit board and semiconductor device using the sameTOSHIBA KK·Filed 2019·Granted Feb 28, 2023·0 cites·17 claims
- 3560US2024206956A1Treatment tool for endoscopeOLYMPUS MEDICAL SYSTEMS CORP·Filed 2023·Application pending·0 cites
- 3658US12043447B2Packaging container for transporting ceramic substratesTOSHIBA KK·Filed 2022·Granted Jul 23, 2024·0 cites·15 claims
- 3758US2024079238A1Bonded object production method and production method for ceramic circuit substrate using sameTOSHIBA KK·Filed 2023·Application pending·0 cites
- 3857US10366938B2Silicon nitride circuit board and electronic component module using the sameTOSHIBA KK·Filed 2018·Granted Jul 30, 2019·0 cites·13 claims
- 3957US2023136593A1Treatment tool for endoscopeOLYMPUS MEDICAL SYSTEMS CORP·Filed 2022·Application pending·0 cites
- 4056US2024197156A1Treatment instrument for endoscopeOLYMPUS MEDICAL SYSTEMS CORP·Filed 2023·Application pending·0 cites
- 4156US2023248424A1Endoscopic treatment deviceOLYMPUS MEDICAL SYSTEMS CORP·Filed 2023·Application pending·0 cites
- 4255US2023137591A1Endoscope treatment tool, and treatment methodOLYMPUS MEDICAL SYSTEMS CORP·Filed 2022·Application pending·0 cites
- 4353US6010761AOptical discSONY CORP·Filed 1998·Granted Jan 4, 2000·16 cites·7 claims
- 4453US2025288347A1Endoscopic treatment instrumentOLYMPUS MEDICAL SYSTEMS CORP·Filed 2025·Application pending·0 cites
- 4553US2023240514A1Endoscopic treatment toolOLYMPUS MEDICAL SYSTEMS CORP·Filed 2023·Application pending·0 cites
- 4652US10109555B2Silicon nitride circuit board and electronic component module using the sameTOSHIBA KK·Filed 2016·Granted Oct 23, 2018·0 cites·15 claims
- 4750US11129282B2Method for manufacturing ceramic circuit boardTOSHIBA KK·Filed 2020·Granted Sep 21, 2021·0 cites·20 claims
- 4850US2022037225A1Ceramic copper circuit board and semiconductor device using sameTOSHIBA KK·Filed 2021·Application pending·0 cites
- 4949US9214617B2Electronic component moduleKATO HIROMASA·Filed 2012·Granted Dec 15, 2015·0 cites·9 claims
- 5046US2008012486A1Getter Material And Evaporable Getter Device Using The Same, And Electron TubeTOSHIBA KK·Filed 2005·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →