Inventor · disambiguated record
Hidenori Koketsu
Also filed as: KOKETSU HIDENORI
8 granted patents·6 pending applications·8 citations·filing 2012–2024
77Inventor score
Top patents by PatentIndex Score
14 records- 0189US11271084B2Semiconductor device and power converterMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Mar 8, 2022·5 cites·19 claims
- 0279US2025120160A1Semiconductor device and power converterMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0373US2024290782A1Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0468US12266706B2Semiconductor device and power converterMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Apr 1, 2025·0 cites·20 claims
- 0568US10186575B2Silicon carbide semiconductor device and a method of manufacturing a silicon carbide semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2018·Granted Jan 22, 2019·1 cites·6 claims
- 0664US12062654B2Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Aug 13, 2024·0 cites·8 claims
- 0760US9006747B2SiC semiconductor element and manufacturing method thereofHATAYAMA TOMOAKI·Filed 2012·Granted Apr 14, 2015·2 cites·21 claims
- 0855US2025261430A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0954US2025266260A1Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1052US12501675B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2023·Granted Dec 16, 2025·0 cites·10 claims
- 1152US2024072124A1Semiconductor device, method of manufacturing semiconductor device, and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1250US11881504B2Semiconductor device and manufacturing method thereforMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Jan 23, 2024·0 cites·7 claims
- 1349US2023387218A1Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1444US10020367B2Silicon carbide semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Jul 10, 2018·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →