Inventor · disambiguated record
Hitoshi Kouno
Also filed as: KOUNO HITOSHI
10 granted patents·3 pending applications·68 citations·filing 2008–2025
86Inventor score
Files withSUMITOMO OSAKA CEMENT CO LTD6FERROTEC MATERIAL TECH CORPORATION3KOSAKAI MAMORU1OHNISHI TOHRU1SASAKI YASUHARU1
Top patents by PatentIndex Score
13 records- 0191US8981263B2Electrostatic chuck apparatusSASAKI YASUHARU·Filed 2010·Granted Mar 17, 2015·15 cites·11 claims
- 0289US8130499B2Heat dissipating structure base board, module using heat dissipating structure base board, and method for manufacturing heat dissipating structure base boardOHNISHI TOHRU·Filed 2008·Granted Mar 6, 2012·39 cites·26 claims
- 0381US10153192B2Electrostatic chuck deviceSUMITOMO OSAKA CEMENT CO LTD·Filed 2016·Granted Dec 11, 2018·3 cites·11 claims
- 0480US9721822B2Electrostatic chuck apparatusTOKYO ELECTRON LTD·Filed 2015·Granted Aug 1, 2017·3 cites·20 claims
- 0575US10923381B2Electrostatic chuck deviceSUMITOMO OSAKA CEMENT CO LTD·Filed 2017·Granted Feb 16, 2021·2 cites·17 claims
- 0671US10262886B2Electrostatic chuck deviceSUMITOMO OSAKA CEMENT CO LTD·Filed 2015·Granted Apr 16, 2019·2 cites·15 claims
- 0770US10068790B2Electrostatic chuck deviceSUMITOMO OSAKA CEMENT CO LTD·Filed 2015·Granted Sep 4, 2018·2 cites·7 claims
- 0867US10502639B2Plate-shaped body for temperature measurement and temperature measuring apparatus provided with the sameKOSAKAI MAMORU·Filed 2012·Granted Dec 10, 2019·2 cites·12 claims
- 0961US2025357180A1Wafer supportFERROTEC MATERIAL TECH CORPORATION·Filed 2025·Application pending·0 cites
- 1058US2025069942A1Wafer supportFERROTEC MATERIAL TECH CORPORATION·Filed 2024·Application pending·0 cites
- 1155US2024177974A1Wafer supportFERROTEC MATERIAL TECH CORPORATION·Filed 2024·Application pending·0 cites
- 1243US11348819B2Electrostatic chuck deviceSUMITOMO OSAKA CEMENT CO LTD·Filed 2018·Granted May 31, 2022·0 cites·9 claims
- 1336US11024528B2Electrostatic chuck device having focus ringSUMITOMO OSAKA CEMENT CO LTD·Filed 2016·Granted Jun 1, 2021·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →