Inventor · disambiguated record
Hirohiko Kozai
Also filed as: KOZAI HIROHIKO
4 granted patents·7 citations·filing 2014–2020
62Inventor score
Technology areasH10P
Files withDISCO CORP4
Top patents by PatentIndex Score
4 records- 0183US9934957B2Method of processing bonded waferDISCO CORP·Filed 2017·Granted Apr 3, 2018·5 cites·1 claims
- 0265US9396976B2Cutting apparatusDISCO CORP·Filed 2014·Granted Jul 19, 2016·2 cites·2 claims
- 0344US9159623B2Wafer processing method for removing organic debrisDISCO CORP·Filed 2014·Granted Oct 13, 2015·0 cites·2 claims
- 0442US11105752B2Inspecting apparatus and processing apparatus including the sameDISCO CORP·Filed 2020·Granted Aug 31, 2021·0 cites·19 claims
Join the waitlist — get patent alerts
Get an alert when Hirohiko Kozai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →