Inventor · disambiguated record
Hideo Kudo
Also filed as: KUDO HIDEO
47 granted patents·3 pending applications·1,294 citations·filing 1986–2012
99Inventor score
Files withSHINETSU HANDOTAI KK31PIONEER ELECTRONIC CORP7PIONEER CORP3SHINETSU POLYMER CO2FUJITSU LTD1
Top patents by PatentIndex Score
50 records- 0194US5942445AMethod of manufacturing semiconductor wafersSHINETSU HANDOTAI KK·Filed 1997·Granted Aug 24, 1999·163 cites·20 claims
- 0293US5117590AMethod of automatically chamfering a wafer and apparatus thereforSHINETSU HANDOTAI KK·Filed 1989·Granted Jun 2, 1992·53 cites·20 claims
- 0388US8318275B2Multi-color molding article, multicolor molding method and substrate storage containerKUDO HIDEO·Filed 2007·Granted Nov 27, 2012·20 cites·12 claims
- 0488US6841218B2Write once optical recording mediumPIONEER CORP·Filed 2003·Granted Jan 11, 2005·27 cites·31 claims
- 0586US7017749B2Precision substrate storage container and retaining member thereforSHINETSU POLYMER CO·Filed 2002·Granted Mar 28, 2006·37 cites·10 claims
- 0686US5800725AMethod of manufacturing semiconductor wafersSHINETSU HANDOTAI KK·Filed 1997·Granted Sep 1, 1998·80 cites·13 claims
- 0783US5317778AAutomatic cleaning apparatus for wafersSHINETSU HANDOTAI KK·Filed 1992·Granted Jun 7, 1994·79 cites·21 claims
- 0882US5679212AMethod for production of silicon wafer and apparatus thereforSHINETSU HANDOTAI KK·Filed 1995·Granted Oct 21, 1997·54 cites·5 claims
- 0980US6951340B2Gaskets for substrate containersSHINETSU POLYMER CO·Filed 2002·Granted Oct 4, 2005·19 cites·2 claims
- 1080US5951374AMethod of polishing semiconductor wafersSHINETSU HANDOTAI KK·Filed 1997·Granted Sep 14, 1999·57 cites·16 claims
- 1180US5656348AOptical recording medium and its recording apparatus and reproducing apparatusPIONEER ELECTRONIC CORP·Filed 1995·Granted Aug 12, 1997·53 cites·8 claims
- 1278US8567384B2Slicing method and wire saw apparatusOISHI HIROSHI·Filed 2008·Granted Oct 29, 2013·8 cites·3 claims
- 1378US6346485B1Semiconductor wafer processing method and semiconductor wafers produced by the sameSHINETSU HANDOTAI KK·Filed 2000·Granted Feb 12, 2002·16 cites·2 claims
- 1473US5185730AMethod for reading data from optical diskPIONEER ELECTRONIC CORP·Filed 1990·Granted Feb 9, 1993·24 cites·10 claims
- 1572US6432837B2Semiconductor wafer processing method and semiconductor wafers produced by the sameSHINETSU HANDOTAI KK·Filed 2001·Granted Aug 13, 2002·11 cites·6 claims
- 1671US8454410B2Polishing apparatusKITAGAWA KOJI·Filed 2008·Granted Jun 4, 2013·4 cites·11 claims
- 1771US5914053AApparatus and method for double-sided polishing semiconductor wafersSHINETSU HANDOTAI KK·Filed 1996·Granted Jun 22, 1999·39 cites·20 claims
- 1870US5179547APhase change optical information recording medium including means for preventing movement of the recorded portionPIONEER ELECTRONIC CORP·Filed 1991·Granted Jan 12, 1993·21 cites·17 claims
- 1969US6050880ASurface grinding device and method of surface grinding a thin-plate workpieceSHINETSU HANDOTAI KK·Filed 1997·Granted Apr 18, 2000·31 cites·18 claims
- 2068US5547515AMethod for handling or processing semiconductor wafersSHINETSU HANDOTAI KK·Filed 1994·Granted Aug 20, 1996·40 cites·3 claims
- 2167US8492879B2Semiconductor substrate and semiconductor deviceOHMI TADAHIRO·Filed 2008·Granted Jul 23, 2013·2 cites·4 claims
- 2267US5503173AWafer cleaning tankSHINETSU HANDOTAI KK·Filed 1994·Granted Apr 2, 1996·42 cites·3 claims
- 2365US8118646B2Carrier for double-side polishing apparatus, double-side polishing apparatus using the same, and double-side polishing methodSATO KAZUYA·Filed 2009·Granted Feb 21, 2012·3 cites·3 claims
- 2465US5081733AAutomatic cleaning apparatus for disksSHINETSU HANDOTAI KK·Filed 1990·Granted Jan 21, 1992·38 cites·14 claims
- 2564US6402594B1Polishing method for wafer and holding plateSHINETSU HANDOTAI KK·Filed 1999·Granted Jun 11, 2002·31 cites·9 claims
- 2664US6110839AMethod of purifying alkaline solution and method of etching semiconductor wafersSHINETSU HANDOTAI KK·Filed 1996·Granted Aug 29, 2000·30 cites·26 claims
- 2764US5827779AMethod of manufacturing semiconductor mirror wafersSHINETSU HANDOTAI KK·Filed 1996·Granted Oct 27, 1998·28 cites·8 claims
- 2862US5126027AThin film forming method and systemFUJITSU LTD·Filed 1990·Granted Jun 30, 1992·28 cites·22 claims
- 2961US6077149AMethod and apparatus for surface-grinding of workpieceSHINETSU HANDOTAI KK·Filed 1997·Granted Jun 20, 2000·24 cites·24 claims
- 3060US6828000B2Optical recording mediumPIONEER CORP·Filed 2002·Granted Dec 7, 2004·4 cites·4 claims
- 3160US5821167AMethod of manufacturing semiconductor mirror wafersSHINETSU HANDOTAI KK·Filed 1996·Granted Oct 13, 1998·24 cites·18 claims
- 3259US6239039B1Semiconductor wafers processing method and semiconductor wafers produced by the sameSHINETSU HANDOTAI KK·Filed 1998·Granted May 29, 2001·17 cites·11 claims
- 3359US5282289AScrubber apparatus for cleaning a thin disk workSHINETSU HANDOTAI KK·Filed 1992·Granted Feb 1, 1994·30 cites·2 claims
- 3458US5474644AMethod and apparatus for high-flatness etching of waferSHINETSU HANDOTAI KK·Filed 1994·Granted Dec 12, 1995·27 cites·4 claims
- 3551US5039558AOptical recording medium and method of manufacturing thereofPIONEER ELECTRONIC CORP·Filed 1990·Granted Aug 13, 1991·7 cites·4 claims
- 3651US5025439AMethod for recording and reproducing of information on an optical disk of a phase-change typePIONEER ELECTRONIC CORP·Filed 1988·Granted Jun 18, 1991·8 cites·4 claims
- 3750US5447890AMethod for production of waferSHINETSU HANDOTAI KK·Filed 1994·Granted Sep 5, 1995·20 cites·3 claims
- 3848US5827395APolishing pad used for polishing silicon wafers and polishing method using the sameSHINETSU HANDOTAI KK·Filed 1995·Granted Oct 27, 1998·12 cites·8 claims
- 3946US5759087AMethod for inducing damage for gettering to single crystal silicon waferSHINETSU HANDOTAI KK·Filed 1995·Granted Jun 2, 1998·12 cites·22 claims
- 4044US5768243AOptical recording medium and its recording apparatus and reproducing apparatusPIONEER ELECTRONIC CORP·Filed 1997·Granted Jun 16, 1998·5 cites·7 claims
- 4144US5555634AWafer holderSHINETSU HANDOTAI KK·Filed 1994·Granted Sep 17, 1996·13 cites·17 claims
- 4243US5595412ADevice for handling wafersSHINETSU HANDOTAI KK·Filed 1994·Granted Jan 21, 1997·13 cites·24 claims
- 4343US2008113510A1Semiconductor Wafer Fabricating Method and Semiconductor Wafer Mirror Edge Polishing MethodSHINETSU HANDOTAI KK·Filed 2006·Application pending·0 cites
- 4442US5866226APolishing agent used for polishing semiconductor wafers and polishing method using the sameSHINETSU HANDOTAI KK·Filed 1996·Granted Feb 2, 1999·8 cites·8 claims
- 4541US4950520AOptical recording medium and method manufacturing thereofPIONEER ELECTRONIC CORP·Filed 1986·Granted Aug 21, 1990·7 cites·5 claims
- 4641US2015206927A1Organic electroluminescent deviceKURODA KAZUO·Filed 2012·Application pending·0 cites
- 4740US5891353APolishing agent used for polishing semiconductor wafers and polishing method using the sameSHINETSU HANDOTAI KK·Filed 1997·Granted Apr 6, 1999·6 cites·8 claims
- 4840US5790252AMethod of and apparatus for determining residual damage to wafer edgesSHINETSU HANDOTAI KK·Filed 1996·Granted Aug 4, 1998·10 cites·2 claims
- 4938US5705423AEpitaxial waferSHINETSU HANDOTAI KK·Filed 1995·Granted Jan 6, 1998·9 cites·2 claims
- 5038US2003235655A1Method of making multi-layer optical recording mediumPIONEER CORP·Filed 2002·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hideo Kudo files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →