Inventor · disambiguated record
Hiroyuki Kunishima
Also filed as: KUNISHIMA HIROYUKI
18 granted patents·4 pending applications·113 citations·filing 2002–2017
93Inventor score
Top patents by PatentIndex Score
22 records- 0191US9508662B2Optical semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Nov 29, 2016·9 cites·9 claims
- 0286US7728432B2Narrow and wide copper interconnections composed of (111), (200) and (511) surfacesNEC ELECTRONICS CORP·Filed 2005·Granted Jun 1, 2010·12 cites·10 claims
- 0385US9835882B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Dec 5, 2017·4 cites·8 claims
- 0485US9312327B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Apr 12, 2016·5 cites·6 claims
- 0584US8946800B2Semiconductor device with protective layer and method of manufacturing sameKUME IPPEI·Filed 2012·Granted Feb 3, 2015·8 cites·26 claims
- 0682US10295743B2Optical semiconductor device, and method for producing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted May 21, 2019·4 cites·13 claims
- 0780US7229921B2Semiconductor device and manufacturing method for the sameNEC ELECTRONICS CORP·Filed 2002·Granted Jun 12, 2007·27 cites·62 claims
- 0879US6949832B2Semiconductor device including dissimilar element-diffused metal layer and manufacturing method thereofNEC ELECTRONICS CORP·Filed 2003·Granted Sep 27, 2005·18 cites·23 claims
- 0976US9478547B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted Oct 25, 2016·3 cites·9 claims
- 1068US6890864B2Semiconductor device fabricating method and treating liquidNEC ELECTRONICS CORP·Filed 2003·Granted May 10, 2005·12 cites·27 claims
- 1167US7476611B2Semiconductor device and manufacturing method thereofNEC ELECTRONICS CORP·Filed 2004·Granted Jan 13, 2009·9 cites·46 claims
- 1262US8357991B2Semiconductor device having interconnect structure for MIM capacitor and fuse elementsRENESAS ELECTRONICS CORP·Filed 2009·Granted Jan 22, 2013·2 cites·14 claims
- 1354US10151881B2Semiconductor device and manufacturing method of the sameRENESAS ELECTRONICS CORP·Filed 2017·Granted Dec 11, 2018·0 cites·11 claims
- 1453US10527872B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Jan 7, 2020·0 cites·13 claims
- 1549US9739943B2Semiconductor device and manufacturing method of the sameRENESAS ELECTRONICS CORP·Filed 2016·Granted Aug 22, 2017·0 cites·12 claims
- 1648US7981574B2Reticle, and method of laying out wirings and viasRENESAS ELECTRONICS CORP·Filed 2009·Granted Jul 19, 2011·0 cites·20 claims
- 1747US2007161156A1Semiconductor device and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 1847US2010072578A1Semiconductor chip and semiconductor waferNEC ELECTRONICS CORP·Filed 2009·Application pending·0 cites
- 1945US7763968B2Semiconductor device featuring large reinforcing elements in pad areaNEC ELECTRONICS CORP·Filed 2006·Granted Jul 27, 2010·0 cites·13 claims
- 2039US7211896B2Semiconductor device and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2004·Granted May 1, 2007·0 cites·9 claims
- 2138US2004251552A1Semiconductor device and manufacturing method the sameNEC ELECTRONICS CORP·Filed 2004·Application pending·0 cites
- 2236US2003027418A1Semiconductor device fabricating method and treating liquidNEC CORP·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →