Inventor · disambiguated record
Hirofumi Kuroda
Also filed as: KURODA HIROFUMI
20 granted patents·4 pending applications·122 citations·filing 1995–2022
94Inventor score
Files withEISAI R&D MAN CO LTD8SUMITOMO BAKELITE CO7EISAI KAGAKU KK2KURODA HIROFUMI2MISHIMA KEISUKE2
Top patents by PatentIndex Score
24 records- 0194US10822307B2High-purity quinoline derivative and method for manufacturing sameEISAI R&D MAN CO LTD·Filed 2019·Granted Nov 3, 2020·10 cites·3 claims
- 0292US10259791B2High-purity quinoline derivative and method for manufacturing sameEISAI R&D MAN CO LTD·Filed 2015·Granted Apr 16, 2019·13 cites·12 claims
- 0391US10407393B2High-purity quinoline derivative and method for manufacturing sameEISAI R&D MAN CO LTD·Filed 2018·Granted Sep 10, 2019·9 cites·3 claims
- 0481US7696286B2Semiconductor encapsulant of epoxy resin, polyphenolic compound, filler and acceleratorSUMITOMO BAKELITE CO·Filed 2007·Granted Apr 13, 2010·11 cites·14 claims
- 0579US6313303B1Process for the preparation of pyridine derivativesEISAI CO LTD·Filed 1998·Granted Nov 6, 2001·27 cites·35 claims
- 0674US2022048862A1High-Purity Quinoline Derivative and Method for Manufacturing SameEISAI R&D MAN CO LTD·Filed 2021·Application pending·0 cites
- 0773US11186547B2High-purity quinoline derivative and method for manufacturing sameEISAI R&D MAN CO LTD·Filed 2020·Granted Nov 30, 2021·0 cites·8 claims
- 0869US7431990B2Resin composition for encapsulating semiconductor chip and semiconductor device therewithSUMITOMO BAKELITE CO·Filed 2005·Granted Oct 7, 2008·2 cites·5 claims
- 0965US8117881B2Press-molding method and press-molding deviceMISHIMA KEISUKE·Filed 2006·Granted Feb 21, 2012·3 cites·5 claims
- 1061US7671146B2Epoxy resin composition for encapsulating semiconductor and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2007·Granted Mar 2, 2010·3 cites·7 claims
- 1158US2024294497A1Method for producing monocyclic pyridine derivativeEISAI R&D MAN CO LTD·Filed 2022·Application pending·0 cites
- 1257US7956136B2Resin composition for semiconductor encapsulation and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2005·Granted Jun 7, 2011·1 cites·15 claims
- 1356US7157313B2Epoxy resin composition and semiconductor device using thereofSUMITOMO BAKELITE CO·Filed 2004·Granted Jan 2, 2007·8 cites·21 claims
- 1456US2024294496A1Production method for synthetic intermediate of monocyclic pyridine derivativeEISAI R&D MAN CO LTD·Filed 2022·Application pending·0 cites
- 1555US8138266B2Semiconductor-encapsulating resin composition and semiconductor deviceKURODA HIROFUMI·Filed 2008·Granted Mar 20, 2012·2 cites·19 claims
- 1654US11838698B2Display apparatus, its control method, and storage mediumCANON KK·Filed 2022·Granted Dec 5, 2023·0 cites·8 claims
- 1754US5547580APurification method of crude productEISAI KAGAKU KK·Filed 1995·Granted Aug 20, 1996·22 cites·13 claims
- 1850US11691990B2Salts of compounds and crystals thereofEISAI R&D MAN CO LTD·Filed 2019·Granted Jul 4, 2023·0 cites·12 claims
- 1943US8092612B2Cooling method and cooling deviceMISHIMA KEISUKE·Filed 2006·Granted Jan 10, 2012·0 cites·4 claims
- 2042US5998611AProcess for producing cephem compounds in an aqueous mediumEISAI KAGAKU KK·Filed 1997·Granted Dec 7, 1999·3 cites·10 claims
- 2141US8124695B2Resin composition for semiconductor encapsulation and semiconductor deviceKURODA HIROFUMI·Filed 2010·Granted Feb 28, 2012·0 cites·15 claims
- 2237US7470754B2Biphenylaralkyl epoxy and phenolic resinsSUMITOMO BAKELITE CO·Filed 2005·Granted Dec 30, 2008·0 cites·9 claims
- 2333US6270701B1Method for fabricating removable denture prothesis using injection moldingG & H DENTAL ARTS INC·Filed 1998·Granted Aug 7, 2001·8 cites·5 claims
- 2432US2018312730A1Resin composition for sealing and electronic component deviceSUMITOMO BAKELITE CO·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →