Inventor · disambiguated record
Hirokazu Masuda
Also filed as: MASUDA HIROKAZU
1 granted patent·9 pending applications·14 citations·filing 2003–2024
36Inventor score
Files withSHIBAURA MECHATRONICS CORP6REHABILITATION3 0 CO LTD2MATSUSHITA ELECTRIC WORKS LTD1SHIBURA MECHATRONICS CORP1
Top patents by PatentIndex Score
10 records- 0163US7076236B2Portable radio communication terminal and call center apparatusMATSUSHITA ELECTRIC WORKS LTD·Filed 2003·Granted Jul 11, 2006·14 cites·16 claims
- 0254US2024328713A1Drying apparatus, dry condition confirmation method, and wafer storage container cleaning apparatusSHIBAURA MECHATRONICS CORP·Filed 2024·Application pending·0 cites
- 0352US2023030655A1Occupational therapy support device, artificial intelligence training device for occupational therapy support device, occupational therapy support method, artificial intelligence training method for occupational therapy support device, occupational therapy support program, and artificial intelligence training programREHABILITATION3 0 CO LTD·Filed 2022·Application pending·0 cites
- 0448US2023107154A1Maintenance method and heat treatment apparatusSHIBAURA MECHATRONICS CORP·Filed 2022·Application pending·0 cites
- 0542US2003159769A1Substrate laminating apparatus and method thereof and substrate detecting apparatusSHIBAURA MECHATRONICS CORP·Filed 2003·Application pending·0 cites
- 0637US2022215927A1Occupational therapy supporting device, artificial intelligence learning device for occupational therapy supporting device, and use method of occupational therapy supporting deviceREHABILITATION3 0 CO LTD·Filed 2021·Application pending·0 cites
- 0733US2004223284A1Electrostatic attracting method, electrostatic attracting apparatus, and bonding apparatusSHIBAURA MECHATRONICS CORP·Filed 2003·Application pending·0 cites
- 0831US2004257522A1Method of bonding substrates and apparatus for bonding substratesSHIBURA MECHATRONICS CORP·Filed 2004·Application pending·0 cites
- 0926US2005022938A1Apparatus for bonding substrates and method for bonding substratesSHIBAURA MECHATRONICS CORP·Filed 2003·Application pending·0 cites
- 1026US2004109124A1Substrate bonding apparatus and liquid crystal display panelSHIBAURA MECHATRONICS CORP·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →