Inventor · disambiguated record
Hideaki Matsubara
Also filed as: MATSUBARA HIDEAKI
11 granted patents·6 pending applications·90 citations·filing 1993–2013
90Inventor score
Files withDAINIPPON SCREEN MFG10JAPAN FINE CERAMICS CT4IZUMI AKIRA1MATSUBARA HIDEAKI1NIPPON TUNGSTEN1
Top patents by PatentIndex Score
17 records- 0186US7410545B2Substrate processing method of and substrate processing apparatus for freezing and cleaning substrateDAINIPPON SCREEN MFG·Filed 2006·Granted Aug 12, 2008·12 cites·10 claims
- 0282US7785671B2Thermal barrier coating system and method of manufacturing the sameJAPAN FINE CERAMICS CT·Filed 2007·Granted Aug 31, 2010·5 cites·6 claims
- 0373US7364806B2Thermal barrier coating system method of manufacturing the sameJAPAN FINE CERAMICS CT·Filed 2004·Granted Apr 29, 2008·12 cites·16 claims
- 0469US7169269B2Plating apparatus, plating cup and cathode ringDAINIPPON SCREEN MFG·Filed 2003·Granted Jan 30, 2007·11 cites·24 claims
- 0568US9120704B2Dielectric layer for electrostatic chuck and electrostatic chuckNIPPON TUNGSTEN·Filed 2013·Granted Sep 1, 2015·2 cites·10 claims
- 0663US7025946B2Method for producing soft magnetic hexagonal ferrite sintered material and soft magnetic hexagonal ferrite sintered materialJAPAN FINE CERAMICS CT·Filed 2002·Granted Apr 11, 2006·7 cites·5 claims
- 0751US2011117368A1Hard Powder, Process for Preparing Hard Powder and Sintered Hard AlloyMATSUBARA HIDEAKI·Filed 2009·Application pending·0 cites
- 0851US2007235341A1Plating apparatus, cartridge and copper dissolution tank for use in the plating apparatus, and plating methodDAINIPPON SCREEN MFG·Filed 2007·Application pending·0 cites
- 0951US2007080057A1Plating apparatus, plating cup and cathode ringDAINIPPON SCREEN MFG·Filed 2006·Application pending·0 cites
- 1051US2007023277A1Plating apparatus, plating cup and cathode ringDAINIPPON SCREEN MFG·Filed 2006·Application pending·0 cites
- 1150US6660665B2Platen for electrostatic wafer clamping apparatusJAPAN FINE CERAMICS CT·Filed 2002·Granted Dec 9, 2003·3 cites·18 claims
- 1250US5554939ANon-destructive measuring sensor for semiconductor wafer and method of manufacturing the sameDAINIPPON SCREEN MFG·Filed 1993·Granted Sep 10, 1996·14 cites·12 claims
- 1350US5475319AMethod of measuring electric charge of semiconductor waferDAINIPPON SCREEN MFG·Filed 1994·Granted Dec 12, 1995·20 cites·10 claims
- 1449US7279079B2Plating apparatus, cartridge and copper dissolution tank for use in the plating apparatus, and plating methodDAINIPPON SCREEN MFG·Filed 2003·Granted Oct 9, 2007·2 cites·9 claims
- 1544US2007221254A1Substrate processing apparatus and substrate processing methodIZUMI AKIRA·Filed 2007·Application pending·0 cites
- 1637US2004084315A1Plating apparatus and plating methodDAINIPPON SCREEN MFG·Filed 2003·Application pending·0 cites
- 1731US5504437AApparatus and method for electrical measurement of semiconductor wafersDAINIPPON SCREEN MFG·Filed 1995·Granted Apr 2, 1996·2 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →