Plating apparatus, plating cup and cathode ring

Abstract

A plating apparatus ( 10 ) provided with: a plating vessel ( 61 a to 61 d ) having a cylindrical side wall ( 361 ) for containing a plating liquid; a substrate holding mechanism ( 74 a to 74 d ) for generally horizontally holding a generally round substrate (W) to be treated; a cathode ring ( 80 ) provided in the substrate holding mechanism and having substantially the same inner diameter as the plating vessel for sealing a peripheral edge portion of a lower surface of the substrate, the cathode ring having a cathode ( 83 ) to be brought into contact with the substrate held by the substrate holding mechanism; and a rotative driving mechanism ( 45 ) for rotating the substrate held by the substrate holding mechanism together with the cathode ring; wherein the plating vessel has an upper edge portion complementary in configuration to a portion of the cathode ring opposed to the plating vessel so that the lower surface of the substrate held by the substrate holding mechanism can approach the plating vessel so as to be substantially flush with the upper edge of the plating vessel without interference between the upper edge portion of the plating vessel and the cathode ring.

1 - 5 . (canceled)  
   
   
       6 . A plating apparatus comprising: 
 a plating vessel for containing a plating liquid for performing a plating process on a substrate to be treated;    a substrate holding mechanism to be disposed above the plating vessel for generally horizontally holding the substrate to bring the substrate into contact with the plating liquid contained in the plating vessel; and    a retracting mechanism having a pivot shaft generally horizontally disposed at a lower height than a bottom of the plating vessel and coupled to the substrate holding mechanism, the retracting mechanism being capable of pivoting the substrate holding mechanism about the pivot shaft to move the substrate holding mechanism between an upper position above the plating vessel and a retracted position apart from the upper position.    
   
   
       7 . A plating apparatus as set forth in  claim 6 , 
 wherein the plating vessel has a cylindrical side wall,    wherein the substrate holding mechanism comprises a cathode ring having substantially the same inner diameter as the plating vessel for sealing a peripheral edge portion of a lower surface of the to-be-treated substrate, the cathode ring being rotatable about a rotation axis thereof, the cathode ring including a cathode to be brought into contact with the substrate held by the substrate holding mechanism,    the plating apparatus further comprising a first adjustment mechanism for aligning a center axis of the plating vessel with the rotation axis of the cathode ring.    
   
   
       8 . A plating apparatus as set forth in  claim 6 , 
 wherein the plating vessel has an upper edge present within substantially the same plane,    the apparatus further comprising a second adjustment mechanism for positioning the upper edge of the plating vessel within a generally horizontal plane.    
   
   
       9 . A plating apparatus as set forth in  claim 6 , 
 wherein the plating vessel has a cylindrical side wall;    wherein the substrate holding mechanism comprises a cathode ring having substantially the same inner diameter as the plating vessel for sealing a peripheral edge portion of a lower surface of the to-be-treated substrate, the cathode ring being rotatable about a rotation axis thereof, the cathode ring including a cathode to be brought into contact with the to-be-treated substrate,    the apparatus further comprising a cathode cleaning liquid supplying mechanism for supplying a cathode cleaning liquid to the cathode for cleaning the cathode in the plating process.    
   
   
       10 . A plating apparatus comprising: 
 a plating vessel for containing a plating liquid;    an anode disposed in the plating vessel;    a mesh member of a resin disposed at a higher height than the anode in the plating vessel; and    a substrate holding mechanism for holding a to-be-treated substrate so as to locate the substrate at a plating position in contact with the plating liquid filled in the plating vessel;    wherein a distance between the substrate located at the plating position and the mesh member is 0.5 mm to 30 mm.    
   
   
       11 . A plating apparatus as set forth in  claim 10 , wherein the mesh member includes a plurality of mesh members which are vertically stacked one on another.  
   
   
       12 . A plating cup comprising: 
 a plating vessel for containing a plating liquid;    a shower head for diffusively introducing the plating liquid into the plating vessel from a plating liquid introduction port provided in a bottom of the plating vessel;    a mesh anode disposed at a higher height than the shower head in the plating vessel; and    a mesh member of a resin disposed at a higher height than the anode in the plating vessel.    
   
   
       13 . A plating cup as set forth in  claim 12 , wherein the mesh member includes a plurality of mesh members which are stacked one on another.  
   
   
       14 . A plating apparatus comprising: 
 a cathode to be brought into contact with a substrate to be treated; and    a cathode cleaning liquid supplying mechanism for supplying a cathode cleaning liquid to the cathode for cleaning the cathode.    
   
   
       15 . A plating apparatus as set forth in  claim 14 , further comprising a conductivity meter disposed downstream of the cathode in a flow channel of the cathode cleaning liquid supplied by the cathode cleaning liquid supplying mechanism for measuring an electrical conductivity of the cathode cleaning liquid.  
   
   
       16 . A plating apparatus as set forth in  claim 15 , further comprising a cathode cleaning liquid collection vessel for collecting the cathode cleaning liquid supplied by the cathode cleaning liquid supplying mechanism.  
   
   
       17 . A plating apparatus for performing a plating process on a to-be-treated substrate with the use of a plating liquid, the apparatus comprising: 
 a liquid supplying mechanism for supplying liquid to a restriction region where intrusion of the plating liquid is prevented in the plating apparatus, the restriction region having a liquid inlet and a liquid outlet; and    a conductivity meter for measuring an electrical conductivity of the liquid flowing out of the outlet of the restriction region.    
   
   
       18 . A plating apparatus as set forth in  claim 17 , wherein the liquid supplying mechanism is capable of supplying the liquid in the plating process.  
   
   
       19 . A plating apparatus as set forth in  claim 17 , further comprising a liquid collection vessel for collecting the liquid supplied by the liquid supplying mechanism.  
   
   
       20 . A plating apparatus comprising: 
 a plating vessel for containing a plating liquid for performing a plating process on a substrate to be treated;    a cathode to be brought into contact with the substrate in the plating process;    a recovery vessel disposed around the plating vessel for recovering the plating liquid overflowing from the plating vessel; and    a cathode cleaning liquid collection vessel disposed around the recovery vessel for collecting a cathode cleaning liquid for cleaning the cathode.    
   
   
       21 . A plating apparatus as set forth in  claim 20 , further comprising a conductivity meter disposed downstream of the cathode in a flow channel of the cathode cleaning liquid used for the cleaning of the cathode for measuring an electrical conductivity of the cathode cleaning liquid.  
   
   
       22 . A plating apparatus as set forth in  claim 20 , further comprising a cathode cleaning liquid supplying mechanism for supplying the cathode cleaning liquid to the cathode for the cleaning of the cathode.  
   
   
       23 . A plating apparatus comprising: 
 an anode for electrically energizing a plating liquid;    a cathode for electrically energizing a substrate to be treated; and    a plating power source for applying a voltage between the anode and the cathode;    wherein an electrical conduction path between the anode and the plating power source and an electrical conduction path between the cathode and the plating power source are isolated from the ground.    
   
   
       24 . A plating apparatus as set forth in  claim 23 , further comprising: 
 a substrate holding mechanism for holding the to-be-treated substrate, the substrate holding mechanism including a rotary shaft;    a rotative driving mechanism for rotating the substrate held by the substrate holding mechanism about the rotary shaft; and    an electrical conduction line provided in the rotary shaft and rotatable together with the rotary shaft by a rotation force of the rotative driving mechanism, the electrical conduction line being electrically connected to the cathode and electrically isolated from the rotary shaft;    wherein the cathode is provided in the substrate holding mechanism and adapted to be brought into contact with the substrate held by the substrate holding mechanism.    
   
   
       25 . A plating apparatus as set forth in  claim 23 , further comprising: 
 a cathode ring provided with the cathode and adapted to be brought into contact with a peripheral edge portion of the to-be-treated substrate;    a spin base which supports the cathode ring; and    an insulative member provided between the cathode ring and the spin base.    
   
   
       26 . A plating apparatus as set forth in  claim 24 , further comprising a rotary connector for electrically connecting the cathode and the plating power source via a liquid metal.  
   
   
       27 . A plating apparatus comprising: 
 a substrate holding mechanism for holding a substrate to be treated;    a cathode to be brought into contact with the substrate held by the substrate holding mechanism;    a first rotary shaft having a first electrical conduction line electrically connected to the cathode, and coupled to the substrate holding mechanism;    a rotative driving mechanism for rotating the substrate held by the substrate holding mechanism about the first rotary shaft;    a second rotary shaft having a second electrical conduction line;    a rotation force transmission mechanism for transmitting a rotative driving force between the first rotary shaft and the second rotary shaft and establishing an electrical conduction path between the first and second electrical conduction lines; and    a rotary connector attached to one end of the second rotary shaft and electrically connected to the second electrical conduction line.    
   
   
       28 . A plating apparatus comprising: 
 a treatment fluid supplying member having a fluid channel formed therein for supplying a treatment fluid to a substrate to be treated; and    a rotary joint being disposed in the treatment fluid supplying member, and including a rotor, a stator and a sliding portion defined between the rotor and the stator, the rotary joint having a main channel to constitute a part of the fluid channel and a leak channel branched from the main channel, the sliding portion being disposed in the leak channel.    
   
   
       29 . A plating apparatus as set forth in  claim 28 , further comprising a substrate holding mechanism having a support shaft to be disposed generally vertically for holding the to-be-treated substrate, 
 wherein the fluid channel is provided in the support shaft,    wherein the rotary joint is attached to one end of the support shaft.    
   
   
       30 . A cathode ring having a cathode to be brought into contact with a peripheral edge portion of a substrate to be treated, the cathode ring comprising: 
 a first electrically conductive member provided in the cathode ring for electrically connecting to a plating power source;    a second electrically conductive member provided in the cathode ring and electrically connected to the cathode; and    a third electrically conductive member provided between the first electrically conductive member and the second electrically conductive member, the third electrically conductive member being resilient and kept in resilient contact with the first and second electrically conductive members for electrical connection between the first electrically conductive member and the second electrically conductive member.    
   
   
       31 . A cathode ring comprising: 
 a ring-shaped support member;    a cathode provided in the support member and adapted to be brought into contact with a peripheral edge portion of a substrate to be treated;    an electrically conductive member provided in the support member and establishing an electrical conduction path between the cathode and a plating power source; and    a seal member provided between the support member and the electrically conductive member for providing a seal between the support member and the electrically conductive member for prevention of intrusion of a plating liquid into the support member.    
   
   
       32 . A cathode ring comprising: 
 a cathode to be brought into contact with a peripheral edge portion of a substrate to be treated; and    a positioning member for fixing the cathode ring in a predetermined position with respect to a spin base which is adapted to rotate while supporting the cathode ring.    
   
   
       33 . A cathode ring comprising: 
 a cathode to be brought into contact with a peripheral edge portion of a substrate to be treated; and    an abutment portion for holding the substrate in abutment against the substrate, the abutment portion being composed of a rigid material and having a sealing surface for sealing the peripheral edge portion of the substrate.    
   
   
       34 - 48 . (canceled)