Inventor · disambiguated record
Hing Jii Mea
Also filed as: MEA HING JII
1 granted patent·2 pending applications·0 citations·filing 2023–2024
11Inventor score
Files withARIECA INC3
Top patents by PatentIndex Score
3 records- 0162US2025197596A1Methods of manufacture for thermal interface materials and apparatuses used thereofARIECA INC·Filed 2024·Application pending·0 cites
- 0257US12027442B1Thermal interface material, an integrated circuit formed therewith, and a method of application thereofARIECA INC·Filed 2023·Granted Jul 2, 2024·0 cites·30 claims
- 0347US2024203754A1Method of deposition of a thermal interface material onto a circuit assembly and an integrated circuit formed therefromARIECA INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →