Inventor · disambiguated record
Hideaki Morigami
Also filed as: MORIGAMI HIDEAKI
7 granted patents·1 pending application·120 citations·filing 1993–2019
82Inventor score
Top patents by PatentIndex Score
8 records- 0183US5425491ABonding tool, production and handling thereofSUMITOMO ELECTRIC INDUSTRIES·Filed 1994·Granted Jun 20, 1995·90 cites·6 claims
- 0270US8178893B2Semiconductor element mounting substrate, semiconductor device using the same, and method for manufacturing semiconductor element mounting substrateTAKASHIMA KOUICHI·Filed 2006·Granted May 15, 2012·7 cites·18 claims
- 0360US7528413B2Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing itSUMITOMO ELECTRIC INDUSTRIES·Filed 2002·Granted May 5, 2009·12 cites·19 claims
- 0443US12112993B2Heat radiation memberALMT CORP·Filed 2019·Granted Oct 8, 2024·0 cites·4 claims
- 0540US11668009B2Composite memberSUMITOMO ELECTRIC INDUSTRIES·Filed 2019·Granted Jun 6, 2023·0 cites·3 claims
- 0638US8664088B2Manufacturing a heat sink material using a discharge wireMORIGAMI HIDEAKI·Filed 2011·Granted Mar 4, 2014·0 cites·1 claims
- 0738US5373731ABonding tool, production and handling thereofSUMITOMO ELECTRIC INDUSTRIES·Filed 1993·Granted Dec 20, 1994·11 cites·3 claims
- 0837US2007215337A1Heat Sink Material, Manufacturing Method For The Same, And Semiconductor Laser DeviceMORIGAMI HIDEAKI·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →