Inventor · disambiguated record
Hideo Mutou
Also filed as: MUTOU HIDEO
5 granted patents·2 pending applications·38 citations·filing 2006–2018
78Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0195US7892949B2Semiconductor device manufacturing method comprising a metal pattern and laser modified regions in a cutting regionRENESAS ELECTRONICS CORP·Filed 2006·Granted Feb 22, 2011·31 cites·5 claims
- 0282US8084334B2Semiconductor device manufacturing method comprising a metal pattern and laser modified regions in a cutting regionABE YOSHIYUKI·Filed 2011·Granted Dec 27, 2011·4 cites·5 claims
- 0381US10002808B2Semiconductor device manufacturing method and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Jun 19, 2018·2 cites·19 claims
- 0469US9070560B2Semiconductor chip with modified regions for dividing the chipRENESAS ELECTRONICS CORP·Filed 2014·Granted Jun 30, 2015·1 cites·18 claims
- 0560US2018277456A1Semiconductor device manufacturing method and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 0654US2015235973A1Semiconductor device manufacturing method and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 0752US8772135B2Semiconductor device manufacturing method using laser irradiation and dicing saw and semiconductor device thereofABE YOSHIYUKI·Filed 2011·Granted Jul 8, 2014·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →