Inventor · disambiguated record
Hirokazu Nakajima
Also filed as: NAKAJIMA HIROKAZU
25 granted patents·11 pending applications·560 citations·filing 1986–2023
97Inventor score
Top patents by PatentIndex Score
36 records- 0190US7176579B2Semiconductor moduleRENESAS TECH CORP·Filed 2003·Granted Feb 13, 2007·61 cites·29 claims
- 0290US6872465B2SolderHITACHI LTD·Filed 2003·Granted Mar 29, 2005·45 cites·26 claims
- 0388US8022551B2Solder composition for electronic devicesRENESAS ELECTRONICS CORP·Filed 2006·Granted Sep 20, 2011·13 cites·11 claims
- 0487US6949835B2Semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Sep 27, 2005·47 cites·13 claims
- 0585US4696581ARolling bearingNTN TOYO BEARING CO LTD·Filed 1986·Granted Sep 29, 1987·42 cites·1 claims
- 0684US5063264ACrystalline polyolefin compositionCHISSO CORP·Filed 1990·Granted Nov 5, 1991·29 cites·23 claims
- 0783US7301781B2Semiconductor moduleRENESAS TECH CORP·Filed 2006·Granted Nov 27, 2007·11 cites·6 claims
- 0882US8742499B2Semiconductor device and manufacturing method thereofNAKAJIMA SHIZUKI·Filed 2009·Granted Jun 3, 2014·14 cites·18 claims
- 0981US7154760B2Power amplifier moduleRENESAS TECH CORP·Filed 2003·Granted Dec 26, 2006·30 cites·7 claims
- 1081US6710263B2Semiconductor devicesRENESAS TECH CORP·Filed 2001·Granted Mar 23, 2004·33 cites·19 claims
- 1181US6005034APropylene-ethylene copolymer composition and process for producing the sameCHISSO CORPOATION·Filed 1996·Granted Dec 21, 1999·53 cites·8 claims
- 1279US7554193B2Semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted Jun 30, 2009·10 cites·6 claims
- 1378US4992111ABearing race member and method of fabricationN T N CORP·Filed 1989·Granted Feb 12, 1991·50 cites·7 claims
- 1476US7075183B2Electronic deviceHITACHI LTD·Filed 2001·Granted Jul 11, 2006·18 cites·9 claims
- 1573US5150974AGrease-sealed bearing with oxide layersNTN TOYO BEARING CO LTD·Filed 1990·Granted Sep 29, 1992·29 cites·2 claims
- 1669US7259465B2Semiconductor device with lead-free solderHITACHI LTD·Filed 2002·Granted Aug 21, 2007·12 cites·20 claims
- 1767US6831360B2Semiconductor device having an elastic resin with a low modulus of elasticityRENESAS TECH CORP·Filed 2001·Granted Dec 14, 2004·13 cites·16 claims
- 1867US4820772APolyolefin compositionCHISSO CORP·Filed 1988·Granted Apr 11, 1989·21 cites·9 claims
- 1965US2025162033A1Magnetic isolation material with counter potential crystals and preparation method thereofHELIAN NEW ENERGY CO LTD·Filed 2023·Application pending·0 cites
- 2063US7223636B2Manufacturing method of semiconductor device and semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted May 29, 2007·11 cites·15 claims
- 2156US5141995AModified propylene polymer composition and process of making compositionCHISSO CORP·Filed 1992·Granted Aug 25, 1992·9 cites·20 claims
- 2252US2009194792A1Semiconductor device and manufacturing method thereforRENESAS TECH CORP·Filed 2009·Application pending·0 cites
- 2349US6989587B2Semiconductor device and manufacturing the sameRENESAS ESATERN JAPAN SEMICOND·Filed 2003·Granted Jan 24, 2006·7 cites·16 claims
- 2449US2006145352A1Electronic deviceHITACHI LTD·Filed 2006·Application pending·0 cites
- 2548US10696596B2Method for producing dielectric ceramic, and dielectric ceramicHITACHI METALS LTD·Filed 2016·Granted Jun 30, 2020·0 cites·7 claims
- 2647US7511315B2Semiconductor device and manufacturing method thereforRENESAS TECH CORP·Filed 2005·Granted Mar 31, 2009·0 cites·16 claims
- 2747US2006267220A1Semiconductor deviceKONISHI SATORU·Filed 2006·Application pending·0 cites
- 2846US10383220B2Ceramic substrate and method for production thereofHITACHI METALS LTD·Filed 2017·Granted Aug 13, 2019·0 cites·9 claims
- 2946US7468294B2Semiconductor device and a method of manufacturing the sameHITACHI LTD·Filed 2004·Granted Dec 23, 2008·2 cites·15 claims
- 3046US2006171130A1Semiconductor moduleRENESAS TECH CORP·Filed 2006·Application pending·0 cites
- 3145US2007105283A1Manufacturing method of semiconductor device and semiconductor deviceRENESAS TECH CORP·Filed 2006·Application pending·0 cites
- 3243US2009260861A1Polycrystalline, magnetic ceramic material, microwave magnetic device, and non-reciprocal circuit device comprising such microwave magnetic deviceHITACHI METALS LTD·Filed 2006·Application pending·0 cites
- 3341US2004007384A1Electronic deviceHITACHI LTD·Filed 2003·Application pending·0 cites
- 3440US2004188834A1Semiconductor deviceFiled 2004·Application pending·0 cites
- 3537US2010230789A1Semiconductor device and manufacturing method thereofRENESAS TECH CORP·Filed 2010·Application pending·0 cites
- 3637US2005029666A1Semiconductor device structural body and electronic deviceFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →