Manufacturing method of semiconductor device and semiconductor device

Abstract

In a dividing method according to the present invention, a wiring board formed of ceramic is forced up (upper swing) by a lower clamp claw of a clamper, and some of a protruded wiring board portion protruding from a conveying chute is pressed against a support body to perform a first division under bending stress. Thereafter, the upward-located clamper is rotatably swung (lower swing) downward to allow an upper clamp claw to press down the protruded wiring board portion, thereby performing a reverse division at the first division section again as a second division. Since the second division allows a tensile force to act on a remaining and thin non-divided resin portion, the non-divided resin portion is torn off. Thus, the perfect division is enabled. Fractionalizing is done by a one-row division and an individual division so that each semiconductor device is formed.

1 - 20 . (canceled)  
   
   
       21 . A semiconductor manufacturing apparatus in which electronic parts are mounted in a plurality of areas respectively, and a wiring board including the electronic parts sealed with an insulating resin is divided every said areas, said semiconductor manufacturing apparatus comprising: 
 a base including the wiring board placed thereover;    a first device part disposed so as to serve as a fulcrum among the plurality of areas adjacent to one another, lying over the wiring board; and    a second device part for moving one end of the wiring board from an upper surface of the base to an upward direction with the first device part as the fulcrum in a state in which the wiring board is placed over the base, and thereafter moving the one end thereof from the upper surface of the base to a downward direction with the first device part as the fulcrum thereby to divide the wiring board among the areas adjacent to one another.    
   
   
       22 . The semiconductor manufacturing apparatus according to  claim 21 , wherein the insulating resin comprises a silicone resin having an elastic modulus of 200 MPa or less at a temperature of 150° C. or higher, and the wiring board comprises ceramic.  
   
   
       23 . The semiconductor manufacturing apparatus according to  claim 22 , further including the second device part for moving the one end of the wiring board to an angle of 80° or more from the upper surface of the base to the upward direction with the first device part as the fulcrum and thereafter moving the one end thereof to an angle of 10° or more from the upper surface of the base to the downward direction with the first device part as the fulcrum to thereby divide the wiring board among the areas adjacent to one another.  
   
   
       24 . An apparatus for manufacturing a semiconductor device in which electronic parts are mounted over a wiring board and the electronic parts are sealed with an insulating resin, comprising a function which adsorbs the insulating resin portion by vacuum adsorption and inspecting a flatness of an upper surface of the insulating resin.