Inventor · disambiguated record
Hideo Nakako
Also filed as: NAKAKO HIDEO
22 granted patents·11 pending applications·19 citations·filing 2002–2025
91Inventor score
Files withHITACHI CHEMICAL CO LTD15RESONAC CORP7NAKAKO HIDEO6SHOWA DENKO MATERIALS CO LTD4FUNYUU SHIGEAKI1
Top patents by PatentIndex Score
33 records- 0182US9457406B2Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid compositionNAKAKO HIDEO·Filed 2010·Granted Oct 4, 2016·5 cites·13 claims
- 0280US9676969B2Composition set, conductive substrate and method of producing the same, and conductive adhesive compositionNAKAKO HIDEO·Filed 2012·Granted Jun 13, 2017·3 cites·18 claims
- 0378US10363608B2Copper paste for joining, method for producing joined body, and method for producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2016·Granted Jul 30, 2019·3 cites·9 claims
- 0476US2024383035A1Electronic component and method for manufacturing electronic componentRESONAC CORP·Filed 2024·Application pending·0 cites
- 0575US12233460B2Copper paste, wick formation method, and heat pipeRESONAC CORP·Filed 2021·Granted Feb 25, 2025·0 cites·20 claims
- 0673US11462502B2Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 4, 2022·2 cites·20 claims
- 0773US11370066B2Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2018·Granted Jun 28, 2022·2 cites·20 claims
- 0870US2025293091A1Method for producing substrate having through-silicon vias, substrate having through-silicon vias, and copper paste for through-silicon via formationRESONAC CORP·Filed 2025·Application pending·0 cites
- 0966US10930612B2Copper paste for pressureless bonding, bonded body and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2017·Granted Feb 23, 2021·1 cites·9 claims
- 1065US11532588B2Copper paste for pressureless bonding, bonded body and semiconductor deviceSHOWA DENKO MATERIALS CO LTD·Filed 2021·Granted Dec 20, 2022·0 cites·7 claims
- 1163US8801971B2Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solutionNAKAKO HIDEO·Filed 2008·Granted Aug 12, 2014·3 cites·7 claims
- 1258US12070800B2Electronic component and method for manufacturing electronic componentSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Aug 27, 2024·0 cites·6 claims
- 1358US2024181575A1Copper paste for forming sintered copper pillars and method for producing bonded bodyRESONAC CORP·Filed 2022·Application pending·0 cites
- 1456US2025387833A1Method for manufacturing conductive via-containing substrate, conductive via-containing substrate, and metal pasteRESONAC CORP·Filed 2024·Application pending·0 cites
- 1553US12354914B2Method for producing substrate having through-silicon vias, substrate having through-silicon vias, and copper paste for through-silicon via formationSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Jul 8, 2025·0 cites·13 claims
- 1652US2024424614A1Metal paste for bonding, and bonded body and method for producing sameRESONAC CORP·Filed 2022·Application pending·0 cites
- 1752US2024300055A1Metal paste for joining, joint, and manufacturing method thereforRESONAC CORP·Filed 2022·Application pending·0 cites
- 1851US10566304B2Assembly and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2016·Granted Feb 18, 2020·0 cites·9 claims
- 1950US10201879B2Silver paste composition and semiconductor device using sameHITACHI CHEMICAL CO LTD·Filed 2013·Granted Feb 12, 2019·0 cites·26 claims
- 2049US2013295276A1Method for forming a copper wiring patternHITACHI CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 2148US2010233011A1Method for forming a copper wiring pattern, and copper oxide particle dispersed slurry used thereinNAKAKO HIDEO·Filed 2008·Application pending·0 cites
- 2247US2009134386A1Organic Field Effect TransistorNAKAKO HIDEO·Filed 2008·Application pending·0 cites
- 2346US10174226B2Adhesive composition and semiconductor device using sameHITACHI CHEMICAL CO LTD·Filed 2013·Granted Jan 8, 2019·0 cites·20 claims
- 2444US11890681B2Method for producing bonded object and semiconductor device and copper bonding pasteSHOWA DENKO MATERIALS CO LTD·Filed 2018·Granted Feb 6, 2024·0 cites·9 claims
- 2542US11483936B2Method for producing joined body, and joining materialHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 25, 2022·0 cites·17 claims
- 2642US10748865B2Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2017·Granted Aug 18, 2020·0 cites·17 claims
- 2742US2005065275A1Thermosetting resin composition of low thermal expansibility and resin filmHITACHI CHEMICAL CO LTD·Filed 2002·Application pending·0 cites
- 2841US9550940B2Etching materialHITACHI CHEMICAL CO LTD·Filed 2013·Granted Jan 24, 2017·0 cites·9 claims
- 2939US11040416B2Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2016·Granted Jun 22, 2021·0 cites·8 claims
- 3039US2012170241A1Printing ink, metal nanoparticles used in the same, wiring, circuit board, and semiconductor packageNAKAKO HIDEO·Filed 2010·Application pending·0 cites
- 3138US11887960B2Member connection methodHITACHI CHEMICAL CO LTD·Filed 2018·Granted Jan 30, 2024·0 cites·5 claims
- 3236US11575076B2Method for manufacturing thermoelectric conversion module, thermoelectric conversion module, and binder for thermoelectric conversion moduleHITACHI CHEMICAL CO LTD·Filed 2018·Granted Feb 7, 2023·0 cites·13 claims
- 3333US9051246B2Compound having trimethylene structure, polymer compound containing unit that has trimethylene structure, and reactive compound having trimethylene structureFUNYUU SHIGEAKI·Filed 2011·Granted Jun 9, 2015·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →