Inventor · disambiguated record
Hisashi Nishigaki
Also filed as: NISHIGAKI HISASHI
9 granted patents·2 pending applications·103 citations·filing 1984–2023
84Inventor score
Top patents by PatentIndex Score
11 records- 0187US6082373ACleaning methodTOSHIBA KK·Filed 1998·Granted Jul 4, 2000·86 cites·26 claims
- 0278US8088438B2Resin layer formation method, resin layer formation device, and disk manufacturing methodITO TOMOKAZU·Filed 2005·Granted Jan 3, 2012·4 cites·6 claims
- 0366US12224250B2Electromagnetic wave attenuator, electronic device, film formation apparatus, and film formation methodSHIBAURA MECHATRONICS CORP·Filed 2023·Granted Feb 11, 2025·0 cites·15 claims
- 0458US12354854B2Film formation apparatusSHIBAURA MECHATRONICS CORP·Filed 2022·Granted Jul 8, 2025·0 cites·7 claims
- 0558US11710707B2Electromagnetic wave attenuator, electronic device, film formation apparatus, and film formation methodSHIBAURA MECHATRONICS CORP·Filed 2021·Granted Jul 25, 2023·0 cites·14 claims
- 0656US8220410B2Resin layer formation method, resin layer formation device, disk, and disk manufacturing methodITO TOMOKAZU·Filed 2010·Granted Jul 17, 2012·0 cites·11 claims
- 0750US8475870B2Resin layer formation method, resin layer formation device, disk and disk manufacturing methodITO TOMOKAZU·Filed 2011·Granted Jul 2, 2013·0 cites·7 claims
- 0846US4564646ALight- and thermosetting resin composition and insulated electrical machinery and appliances using the sameHITACHI CHEMICAL CO LTD·Filed 1984·Granted Jan 14, 1986·11 cites·13 claims
- 0944US7913737B2Bonding apparatus and bonding methodSHIBAURA MECHATRONICS CORP·Filed 2004·Granted Mar 29, 2011·2 cites·20 claims
- 1041US2010102044A1Film cutting apparatus and film cutting methodTAKIZAWA YOJI·Filed 2007·Application pending·0 cites
- 1139US2009294073A1Substrate processing apparatusTAKIZAWA YOJI·Filed 2007·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hisashi Nishigaki files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →