Inventor · disambiguated record
Hidenobu Nishikawa
Also filed as: NISHIKAWA HIDENOBU
20 granted patents·3 pending applications·268 citations·filing 2000–2012
95Inventor score
Files withPANASONIC CORP9MATSUSHITA ELECTRIC INDUSTRIAL CO LTD7NISHIKAWA HIDENOBU4NISHIDA KAZUTO1OCHI SHOZO1
Top patents by PatentIndex Score
23 records- 0198US7683482B2Electronic component unitPANASONIC CORP·Filed 2006·Granted Mar 23, 2010·57 cites·8 claims
- 0294US6926796B1Electronic parts mounting method and device thereforMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Aug 9, 2005·57 cites·2 claims
- 0392US8007627B2Electronic component mounting method and apparatusPANASONIC CORP·Filed 2005·Granted Aug 30, 2011·18 cites·1 claims
- 0491US7775446B2Card type information device and method for manufacturing samePANASONIC CORP·Filed 2007·Granted Aug 17, 2010·31 cites·11 claims
- 0583US8223500B2Memory card and method for manufacturing the sameYAMADA YUICHIRO·Filed 2008·Granted Jul 17, 2012·17 cites·12 claims
- 0679US7939923B2Memory card and method for manufacturing memory cardPANASONIC CORP·Filed 2007·Granted May 10, 2011·10 cites·13 claims
- 0779US7933127B2Memory card and memory card manufacturing methodPANASONIC CORP·Filed 2007·Granted Apr 26, 2011·9 cites·12 claims
- 0876US8031127B2Semiconductor memory module incorporating antennaPANASONIC CORP·Filed 2007·Granted Oct 4, 2011·6 cites·17 claims
- 0975US7471260B2Semiconductor memory module having built-in antennaPANASONIC CORP·Filed 2006·Granted Dec 30, 2008·7 cites·11 claims
- 1070US8125786B2Memory cardNISHIKAWA HIDENOBU·Filed 2007·Granted Feb 28, 2012·4 cites·12 claims
- 1169US7355126B2Electronic parts packaging method and electronic parts packageMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Apr 8, 2008·17 cites·19 claims
- 1264US8291582B2Circuit board and process for producing the sameNISHIKAWA HIDENOBU·Filed 2007·Granted Oct 23, 2012·2 cites·3 claims
- 1364US6770320B2Apparatus and method for applying fluidMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Aug 3, 2004·7 cites·4 claims
- 1463US7060528B2Method for mounting a semiconductor element to an interposer by compression bondingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jun 13, 2006·11 cites·16 claims
- 1560US6561408B2Bonding head and component mounting apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted May 13, 2003·9 cites·20 claims
- 1655US8599571B2Memory cardNISHIKAWA HIDENOBU·Filed 2007·Granted Dec 3, 2013·1 cites·8 claims
- 1754US7076867B2Pressurizing methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jul 18, 2006·5 cites·16 claims
- 1851US8866021B2Circuit board and process for producing the sameNISHIKAWA HIDENOBU·Filed 2012·Granted Oct 21, 2014·0 cites·7 claims
- 1950US2005224974A1Electronic component mounting method and apparatusNISHIDA KAZUTO·Filed 2005·Application pending·0 cites
- 2042US7910406B2Electronic circuit device and method for manufacturing samePANASONIC CORP·Filed 2006·Granted Mar 22, 2011·0 cites·6 claims
- 2141US2009051606A1Electronic circuit module with built-in antenna and method for manufacturing the sameOCHI SHOZO·Filed 2007·Application pending·0 cites
- 2240US8035225B2Semiconductor chip assembly and fabrication method thereforPANASONIC CORP·Filed 2005·Granted Oct 11, 2011·0 cites·5 claims
- 2340US2005036057A1Image pickup device integrated with lens, method and apparatus for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hidenobu Nishikawa files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →