US2005224974A1PendingUtilityA1

Electronic component mounting method and apparatus

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Assignee: NISHIDA KAZUTOPriority: Jan 29, 1999Filed: Jun 13, 2005Published: Oct 13, 2005
Est. expiryJan 29, 2019(expired)· nominal 20-yr term from priority
Inventors:Kazuto NishidaHidenobu NishikawaYoshinori WadaHiroyuki Otani
H05K 3/323H10W 99/00H10W 90/734H10W 90/724H10W 74/00H10W 72/9415H10W 72/07551H10W 72/07338H10W 72/07311H10W 72/07236H10W 72/07141H10W 72/5525H10W 72/5524H10W 72/5522H10W 72/01365H10W 72/01225H10W 72/952H10W 72/0711H10W 72/552H10W 72/354H10W 72/352H10W 72/351H10W 72/325H10W 72/322H10W 72/261H10W 72/252H10W 72/251H10W 72/242H10W 72/241H10W 72/074H10W 72/073H10W 72/072H10W 72/59H10W 72/50H10W 72/29H10W 72/20H10W 72/012H10W 74/473H10W 74/15H10W 74/012H10W 72/013H10W 72/01336H10W 72/30Y10T29/4913H05K 3/32
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Claims

Abstract

A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is connected, the bumps are compressed, and the insulating resin is hardened.

Claims

exact text as granted — not AI-modified
1 . An electronic component unit comprising: 
 an electronic component having a first electrode and a bump on said first electrode;    a circuit board having a second electrode electrically connected to said first electrode via said bump after said bump is crushed; and    an insulating resin layer between said electronic component and said circuit board, said insulating resin layer including an insulating resin mixed with an inorganic filler,    wherein said insulating resin layer has a first portion and a second portion, with said first portion being in contact with said second portion, said second portion being in contact with one of said electronic component and said circuit board, and said second portion having an amount of said inorganic filler that is not less than an amount of said inorganic filer in said first portion, and    wherein said bump is crushed during bonding of said electronic component to said circuit board.    
     
     
         2 . The electronic component unit according to  claim 1 , wherein 
 said first portion comprises a first resin layer and said second portion comprises a second resin layer, with said second resin layer being in contact with said circuit board.    
     
     
         3 . The electronic component unit according to  claim 1 , wherein 
 said first portion comprises a first resin layer and said second portion comprises a second resin layer, with said second resin layer being in contact with said electronic component.    
     
     
         4 . The electronic component unit according to  claim 1 , wherein 
 said first portion comprises a first resin layer and a third resin layer, and said second portion comprises a second resin layer,    with said first resin layer being in contact with said circuit board, said second resin layer being in contact with said first resin layer, an amount of said inorganic filler in said second resin layer being not less than an amount of said inorganic filler in said first resin layer and an amount of said inorganic filler in said third resin layer, and said third resin layer being in contact with said electronic component and said second resin layer.    
     
     
         5 . The electronic component unit according to  claim 1 , wherein 
 an amount of said inorganic filler in said insulating resin layer is gradually varied throughout said insulating resin layer.    
     
     
         6 . The electronic component unit according to  claim 5 , wherein 
 said second portion is in contact with said circuit board.    
     
     
         7 . The electronic component unit according to  claim 5 , wherein 
 said second portion is in contact with said electronic component.    
     
     
         8 . The electronic component unit according to  claim 5 , wherein 
 said second portion is in contact with said circuit board, and    said insulating resin layer further has a third portion in contact with said first portion and said electronic component, with said amount of said inorganic filler in said third portion being not less than an amount of said inorganic filler in said first portion.    
     
     
         9 . The electronic component unit according to  claim 2 , wherein 
 said amount of said inorganic filler in said first resin layer is 20 wt %, and said amount of said inorganic filler in said second resin layer is not less than 20 wt %.    
     
     
         10 . The electronic component unit according to  claim 1 , wherein 
 said amount of said inorganic filler in said first portion is 20 wt %, and said amount of said inorganic filler in said second portion is not less than 20 wt %.

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