Inventor · disambiguated record
Hiroyuki Otani
Also filed as: OTANI HIROYUKI
23 granted patents·2 pending applications·401 citations·filing 1996–2007
96Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD19PANASONIC CORP2NEC CORP1NISHIDA KAZUTO1WATANABE TETSUYA1
Top patents by PatentIndex Score
25 records- 0198US7683482B2Electronic component unitPANASONIC CORP·Filed 2006·Granted Mar 23, 2010·57 cites·8 claims
- 0294US6926796B1Electronic parts mounting method and device thereforMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Aug 9, 2005·57 cites·2 claims
- 0392US8007627B2Electronic component mounting method and apparatusPANASONIC CORP·Filed 2005·Granted Aug 30, 2011·18 cites·1 claims
- 0480US7071090B2Semiconductor element having protruded bump electrodesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jul 4, 2006·7 cites·5 claims
- 0579US6467670B2Method and apparatus for mounting componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Oct 22, 2002·19 cites·18 claims
- 0679US6207549B1Method of forming a ball bond using a bonding capillaryMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Mar 27, 2001·45 cites·32 claims
- 0777US6193136B1Component mounting method and apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Feb 27, 2001·32 cites·23 claims
- 0875US6651320B1Method for mounting semiconductor element to circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Nov 25, 2003·49 cites·6 claims
- 0969US7355126B2Electronic parts packaging method and electronic parts packageMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Apr 8, 2008·17 cites·19 claims
- 1068US6061248ASemiconductor chip-mounting board providing a high bonding strength with a semiconductor chip mounted thereonMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted May 9, 2000·29 cites·10 claims
- 1163US7060528B2Method for mounting a semiconductor element to an interposer by compression bondingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jun 13, 2006·11 cites·16 claims
- 1261US7430644B2Storage device, control method for partitioning logical memory devices, and medium embodying program for partitioning logical memory devicesNEC CORP·Filed 2005·Granted Sep 30, 2008·2 cites·3 claims
- 1360US6135024AScreen printing method and printing apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Oct 24, 2000·20 cites·6 claims
- 1458US6894387B2Semiconductor element having protruded bump electrodesMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 17, 2005·6 cites·17 claims
- 1554US8236868B2Process for producing polyurethane elastomer foamsWATANABE TETSUYA·Filed 2007·Granted Aug 7, 2012·0 cites·9 claims
- 1652US6825055B2Method for assembling integral type electronic component and integral type electronic componentMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Nov 30, 2004·3 cites·13 claims
- 1750US2005224974A1Electronic component mounting method and apparatusNISHIDA KAZUTO·Filed 2005·Application pending·0 cites
- 1848US6971167B2Multilayered circuit board forming method and multilayered circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Dec 6, 2005·2 cites·17 claims
- 1947US6055724AMethod and device for sealing IC chipMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted May 2, 2000·13 cites·11 claims
- 2046US6453811B1Printing method and printing apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Sep 24, 2002·2 cites·3 claims
- 2143US2005001315A1Method for assembling integral type electronic device, and integral type electronic deviceFiled 2004·Application pending·0 cites
- 2241US6787922B2Semiconductor chip—mounting boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Sep 7, 2004·0 cites·5 claims
- 2340US6328196B1Bump bonding device and bump bonding methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Dec 11, 2001·8 cites·5 claims
- 2438US6481616B2Bump bonding device and bump bonding methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Nov 19, 2002·0 cites·7 claims
- 2536US6566165B1Method for mounting a semiconductor chip to a semiconductor chip-mounting boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted May 20, 2003·4 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →