Inventor · disambiguated record
Hidetoshi Nishimura
Also filed as: NISHIMURA HIDETOSHI
39 granted patents·14 pending applications·250 citations·filing 1996–2024
97Inventor score
Top patents by PatentIndex Score
53 records- 0191US8368225B2Semiconductor integrated circuit device having improved interconnect accuracy near cell boundariesPANASONIC CORP·Filed 2011·Granted Feb 5, 2013·12 cites·16 claims
- 0290US8692336B2Semiconductor deviceTAMARU MASAKI·Filed 2012·Granted Apr 8, 2014·9 cites·9 claims
- 0390US7923755B2Semiconductor integrated circuit and method of designing semiconductor integrated circuitPANASONIC CORP·Filed 2010·Granted Apr 12, 2011·16 cites·4 claims
- 0489US9967555B2Simulation deviceHOYA CORP·Filed 2013·Granted May 8, 2018·10 cites·7 claims
- 0588US8159013B2Semiconductor integrated circuit device having a dummy metal wiring lineNISHIMURA HIDETOSHI·Filed 2009·Granted Apr 17, 2012·27 cites·17 claims
- 0687US8766322B2Layout structure of standard cell, standard cell library, and layout structure of semiconductor integrated circuitOKAMOTO NANA·Filed 2010·Granted Jul 1, 2014·13 cites·18 claims
- 0787US7800140B2Semiconductor integrated circuitPANASONIC CORP·Filed 2008·Granted Sep 21, 2010·13 cites·16 claims
- 0884US9610667B2Lens edgeing system, method of detecting a tool exchange time and method of manufacturing spectacle lensHOYA CORP·Filed 2013·Granted Apr 4, 2017·5 cites·10 claims
- 0984US8946826B2Semiconductor devicePANASONIC CORP·Filed 2014·Granted Feb 3, 2015·4 cites·4 claims
- 1082US8648392B2Semiconductor integrated circuitNISHIMURA HIDETOSHI·Filed 2010·Granted Feb 11, 2014·7 cites·20 claims
- 1182US5761337AMethod and apparatus for inspection of the appearance of bumpsSHARP KK·Filed 1996·Granted Jun 2, 1998·72 cites·15 claims
- 1280US8004014B2Semiconductor integrated circuit device having metal interconnect regions placed symmetrically with respect to a cell boundaryPANASONIC CORP·Filed 2009·Granted Aug 23, 2011·6 cites·25 claims
- 1379US9147652B2Layout structure of standard cell, standard cell library, and layout structure of semiconductor integrated circuitPANASONIC CORP·Filed 2014·Granted Sep 29, 2015·4 cites·8 claims
- 1477US10593702B2Semiconductor deviceSOCIONEXT INC·Filed 2018·Granted Mar 17, 2020·1 cites·26 claims
- 1576US10083985B2Semiconductor deviceSOCIONEXT INC·Filed 2017·Granted Sep 25, 2018·1 cites·18 claims
- 1674US9741740B2Semiconductor deviceSOCIONEXT INC·Filed 2016·Granted Aug 22, 2017·1 cites·11 claims
- 1773US8426978B2Semiconductor device including a first wiring having a bending portion and a via including the bending portionICHIRYU MIWA·Filed 2010·Granted Apr 23, 2013·5 cites·17 claims
- 1872US7800151B2Semiconductor integrated circuit and method of designing semiconductor integrated circuitPANASONIC CORP·Filed 2007·Granted Sep 21, 2010·5 cites·4 claims
- 1971US11351650B2Spectacle lens manufacturing methodHOYA LENS THAILAND LTD·Filed 2019·Granted Jun 7, 2022·0 cites·7 claims
- 2071US6791391B2Level shifting circuitMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Sep 14, 2004·16 cites·2 claims
- 2169US10549398B2Block device, spectacle lens manufacturing method, and programHOYA LENS THAILAND LTD·Filed 2014·Granted Feb 4, 2020·1 cites·4 claims
- 2269US7619684B2Camera module, manufacturing method of camera module, electronic apparatus, and manufacturing method of electronic apparatusSHARP KK·Filed 2004·Granted Nov 17, 2009·11 cites·24 claims
- 2368US9362264B2Semiconductor device comprising a plurality of cell arrays including a well potential supply region and adjacent dummy gates provided on a well region of a cell arrayPANASONIC CORP·Filed 2014·Granted Jun 7, 2016·1 cites·13 claims
- 2467US8841774B2Semiconductor device including a first wiring having a bending portion a viaPANASONIC CORP·Filed 2013·Granted Sep 23, 2014·2 cites·19 claims
- 2567US7514795B2Semiconductor integrated circuit having improved power supply wiringPANASONIC CORP·Filed 2005·Granted Apr 7, 2009·3 cites·6 claims
- 2663US8698273B2Semiconductor integrated circuit device having improved interconnect accuracy near cell boundariesPANASONIC CORP·Filed 2012·Granted Apr 15, 2014·1 cites·3 claims
- 2763US2025344934A1Medical system, control system, and water supply control methodOLYMPUS CORP·Filed 2024·Application pending·0 cites
- 2862US2024324865A1Endoscope system and treatment method endoscopic treatment toolOLYMPUS CORP·Filed 2024·Application pending·0 cites
- 2960US9733490B2Spectacle lens design system, supply system, design method and manufacturing methodHOYA CORP·Filed 2014·Granted Aug 15, 2017·1 cites·16 claims
- 3060US9618772B2Spectacle lens design system, supply system, design method and manufacturing methodHOYA CORP·Filed 2014·Granted Apr 11, 2017·1 cites·17 claims
- 3160US7932610B2Semiconductor integrated circuit having improved power supply wiringPANASONIC CORP·Filed 2009·Granted Apr 26, 2011·1 cites·8 claims
- 3258US2025064533A1Processing system, endoscope system, and processing methodOLYMPUS CORP·Filed 2024·Application pending·0 cites
- 3357US2024307127A1Processing apparatus and information processing methodOLYMPUS CORP·Filed 2024·Application pending·0 cites
- 3457US2024321434A1Information processing system, medical system, and information processing methodOLYMPUS CORP·Filed 2024·Application pending·0 cites
- 3556US12244971B2Information processing device, information processing method and computer-readable recording mediumEVIDENT CORP·Filed 2021·Granted Mar 4, 2025·0 cites·16 claims
- 3656US9373611B2Semiconductor integrated circuit deviceNISHIMURA HIDETOSHI·Filed 2012·Granted Jun 21, 2016·1 cites·16 claims
- 3756US9346783B2Method and apparatus for producing oxidized compoundTAKEDA PHARMACEUTICAL·Filed 2013·Granted May 24, 2016·0 cites·2 claims
- 3855US11972619B2Information processing device, information processing system, information processing method and computer-readable recording mediumEVIDENT CORP·Filed 2021·Granted Apr 30, 2024·0 cites·7 claims
- 3951US2009160999A1Sensor module, electronic information device, autofocus controlling method, control program and readable recording mediumSHARP KK·Filed 2008·Application pending·0 cites
- 4050US10754425B2Information processing apparatus, information processing method, and non-transitory computer readable recording mediumOLYMPUS CORP·Filed 2019·Granted Aug 25, 2020·0 cites·5 claims
- 4150US7859023B2Standard cell and semiconductor device including the samePANASONIC CORP·Filed 2008·Granted Dec 28, 2010·0 cites·4 claims
- 4247US10971174B2Information processing apparatus, information processing method, and non-transitory computer readable recording mediumOLYMPUS CORP·Filed 2019·Granted Apr 6, 2021·0 cites·20 claims
- 4347US8592598B2Method of producing a crystal of an imidazole compoundKANEKO MASAYOSHI·Filed 2005·Granted Nov 26, 2013·0 cites·3 claims
- 4447US8022549B2Standard cell and semiconductor device including the samePANASONIC CORP·Filed 2010·Granted Sep 20, 2011·0 cites·3 claims
- 4547US2014217513A1Semiconductor integrated circuit devicePANASONIC CORP·Filed 2014·Application pending·0 cites
- 4645US2019354176A1Information processing apparatus, information processing method, and computer readable recording mediumOLYMPUS CORP·Filed 2019·Application pending·0 cites
- 4743US8143724B2Standard cell and semiconductor device including the sameOZOE RITSUKO·Filed 2011·Granted Mar 27, 2012·0 cites·3 claims
- 4842US2008169487A1Layout structure of semiconductor integrated circuitSHIMBO HIROYUKI·Filed 2008·Application pending·0 cites
- 4941US2021297635A1Information processing device, information processing method, and computer-readable recording mediumOLYMPUS CORP·Filed 2021·Application pending·0 cites
- 5041US2013087881A1Semiconductor integrated circuit devicePANASONIC CORP·Filed 2012·Application pending·0 cites
Showing the top 50 of 53 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →