Inventor · disambiguated record
Hiroshi Nishizuka
Also filed as: MORITA KOYO · NISHIZUKA HIROSHI
12 granted patents·302 citations·filing 1978–2000
93Inventor score
Top patents by PatentIndex Score
12 records- 0190US5025284AExposure method and exposure apparatusHITACHI LTD·Filed 1990·Granted Jun 18, 1991·53 cites·20 claims
- 0290US4699505AExposure method and exposure apparatusHITACHI LTD·Filed 1985·Granted Oct 13, 1987·46 cites·33 claims
- 0382US4298273AProjection aligner and method of positioning a waferHITACHI LTD·Filed 1979·Granted Nov 3, 1981·34 cites·29 claims
- 0480US4598197AProjection alignerHITACHI LTD·Filed 1983·Granted Jul 1, 1986·41 cites·16 claims
- 0576US4974018AExposure method and exposure apparatusHITACHI LTD·Filed 1988·Granted Nov 27, 1990·20 cites·9 claims
- 0661US4783225AWafer and method of working the sameHITACHI LTD·Filed 1986·Granted Nov 8, 1988·27 cites·13 claims
- 0757US4701608AProjection aligner with a sensor for monitoring light quantityHITACHI LTD·Filed 1986·Granted Oct 20, 1987·19 cites·21 claims
- 0856US4218136AMethod of and apparatus for aligning photomaskHITACHI LTD·Filed 1978·Granted Aug 19, 1980·12 cites·10 claims
- 0951US5230747AWafer having chamfered bend portions in the joint regions between the contour of the wafer and the cut-away portion of the waferHITACHI LTD·Filed 1991·Granted Jul 27, 1993·17 cites·3 claims
- 1049US5279992AMethod of producing a wafer having a curved notchHITACHI LTD·Filed 1992·Granted Jan 18, 1994·18 cites·4 claims
- 1149US4780606AProjection aligner method utilizing monitoring of light quantityHITACHI LTD·Filed 1987·Granted Oct 25, 1988·14 cites·29 claims
- 1244USRE40139EWafer having chamfered bend portions in the joint regions between the contour of the cut-away portion of the waferRENESAS TECH CORP·Filed 2000·Granted Mar 4, 2008·1 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →