Inventor · disambiguated record
Hideki Numazawa
Also filed as: NUMAZAWA HIDEKI
5 granted patents·157 citations·filing 1997–2001
84Inventor score
Top patents by PatentIndex Score
5 records- 0184US5955512APressure sensitive adhesive composition and sheet having layer thereofLINTEC CORP·Filed 1997·Granted Sep 21, 1999·50 cites·15 claims
- 0277US6524700B2Pressure sensitive adhesive sheet for wafer stickingNEC CORP·Filed 2001·Granted Feb 25, 2003·20 cites·2 claims
- 0376US5976691AProcess for producing chip and pressure sensitive adhesive sheet for said processLINTEC CORP·Filed 1997·Granted Nov 2, 1999·42 cites·4 claims
- 0475US6225194B1Process for producing chip and pressure sensitive adhesive sheet for said processLINTEC CORP·Filed 1999·Granted May 1, 2001·40 cites·3 claims
- 0550US6605345B2Ultraviolet-curable pressure sensitive adhesive composition and ultraviolet-curable pressure sensitive adhesive sheetLINTEC CORP·Filed 2001·Granted Aug 12, 2003·5 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →