Inventor · disambiguated record
Hiroto Ogata
Also filed as: OGATA HIROTO
21 granted patents·25 pending applications·62 citations·filing 2006–2025
90Inventor score
Top patents by PatentIndex Score
46 records- 0192US7293833B2Chair and support mechanism unit thereofITOKI CORP·Filed 2006·Granted Nov 13, 2007·55 cites·10 claims
- 0279US2025376645A1Method for producing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2025·Application pending·0 cites
- 0378US10437151B2Cationically polymerizable resist underlayer film-forming compositionNISSAN CHEMICAL IND LTD·Filed 2016·Granted Oct 8, 2019·1 cites·9 claims
- 0474US11112696B2Protective film-forming compositionNISSAN CHEMICAL CORP·Filed 2017·Granted Sep 7, 2021·2 cites·10 claims
- 0572US12332566B2Resist underlayer film-forming compositionNISSAN CHEMICAL CORP·Filed 2019·Granted Jun 17, 2025·0 cites·10 claims
- 0672US2025199409A1Resist underlayer film-forming compositionNISSAN CHEMICAL CORP·Filed 2025·Application pending·0 cites
- 0771US9793131B2Pattern forming method using resist underlayer filmNISSAN CHEMICAL IND LTD·Filed 2014·Granted Oct 17, 2017·2 cites·8 claims
- 0868US9678427B2Resist underlayer film-forming composition containing copolymer that has triazine ring and sulfur atom in main chainNISSAN CHEMICAL IND LTD·Filed 2014·Granted Jun 13, 2017·1 cites·6 claims
- 0967US11003078B2Compositions for forming a protective film against basic aqueous hydrogen peroxide solution, and pattern formation methodNISSAN CHEMICAL CORP·Filed 2017·Granted May 11, 2021·1 cites·10 claims
- 1065US11542366B2Composition for forming resist underlayer film and method for forming resist pattern using sameNISSAN CHEMICAL IND LTD·Filed 2020·Granted Jan 3, 2023·0 cites·3 claims
- 1163US2025153225A1Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and peeling compositionNISSAN CHEMICAL CORP·Filed 2025·Application pending·0 cites
- 1260US9534140B2Resist underlayer film-forming compositionNISSAN CHEMICAL IND LTD·Filed 2013·Granted Jan 3, 2017·0 cites·6 claims
- 1358US2023131533A1Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and peeling compositionNISSAN CHEMICAL CORP·Filed 2021·Application pending·0 cites
- 1458US2023129238A1Cleaning agent composition and method for producing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2021·Application pending·0 cites
- 1557US12215259B2Multilayer object and release agent compositionNISSAN CHEMICAL CORP·Filed 2021·Granted Feb 4, 2025·0 cites·20 claims
- 1657US2024176243A1Resist underlayer film-forming compositionNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 1755US12297381B2Laminate, release agent composition, and method for manufacturing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2021·Granted May 13, 2025·0 cites·6 claims
- 1854US12386262B2Resist underlayer film-forming composition using carbon-oxygen double bondNISSAN CHEMICAL CORP·Filed 2019·Granted Aug 12, 2025·0 cites·24 claims
- 1954US12044969B2Resist underlayer film-forming compositionNISSAN CHEMICAL CORP·Filed 2020·Granted Jul 23, 2024·0 cites·11 claims
- 2054US2025347998A1Alkoxy group-containing composition for forming resist underlayer filmNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 2151US11319514B2Composition for forming a coating film for removing foreign mattersNISSAN CHEMICAL CORP·Filed 2018·Granted May 3, 2022·0 cites·14 claims
- 2251US10844167B2Composition for forming resist underlayer film and method for forming resist pattern using sameNISSAN CHEMICAL IND LTD·Filed 2017·Granted Nov 24, 2020·0 cites·3 claims
- 2350US2024182766A1Adhesive composition, laminate, method for producing laminate, and method for producing semiconductor substrateNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 2450US2024208179A1Laminate, release agent composition, and method for manufacturing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 2549US11635692B2Resist underlying film forming compositionNISSAN CHEMICAL CORP·Filed 2018·Granted Apr 25, 2023·0 cites·12 claims
- 2649US2024006221A1Laminate, method for manufacturing laminate, and method for manufacturting semiconductor substrateNISSAN CHEMICAL CORP·Filed 2021·Application pending·0 cites
- 2748US2024222180A1Laminate, method for manufacturing laminate, and method for manufacturing semiconductor substrateNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 2847US12072630B2Resist underlayer film-forming composition including cyclic carbonyl compoundNISSAN CHEMICAL CORP·Filed 2019·Granted Aug 27, 2024·0 cites·13 claims
- 2947US2024302747A1Naphthalene unit-containing resist underlayer film-forming compositionNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 3047US2022334483A1Resist underlayer film-forming compositionNISSAN CHEMICAL CORP·Filed 2020·Application pending·0 cites
- 3147US2024427246A1Resist underlayer film-forming composition containing terminated polymerNISSAN CHEMICAL CORP·Filed 2023·Application pending·0 cites
- 3246US2020041905A1Resist underlying film-forming composition containing an amide group-containing polyesterNISSAN CHEMICAL CORP·Filed 2017·Application pending·0 cites
- 3345US2023151307A1Method for manufacturing semiconductor substrate, method for manufacturing processed semiconductor substrate, and release compositionNISSAN CHEMICAL CORP·Filed 2021·Application pending·0 cites
- 3445US2023343629A1Laminate and release agent compositionNISSAN CHEMICAL CORP·Filed 2021·Application pending·0 cites
- 3545US2023131428A1Semiconductor substrate cleaning method, processed semiconductor substrate manufacturing method, and composition for peelingNISSAN CHEMICAL CORP·Filed 2021·Application pending·0 cites
- 3644US12313972B2Resist underlayer film-forming compositionNISSAN CHEMICAL CORP·Filed 2020·Granted May 27, 2025·0 cites·9 claims
- 3744US11287741B2Resist underlayer film-forming compositionNISSAN CHEMICAL CORP·Filed 2018·Granted Mar 29, 2022·0 cites·6 claims
- 3844US11131928B2Resist underlayer film forming composition which contains compound having glycoluril skeleton as additiveNISSAN CHEMICAL CORP·Filed 2017·Granted Sep 28, 2021·0 cites·14 claims
- 3944US2022411684A1Adhesive composition, laminate and method for producing same, method for peeling laminate, and method for processing semiconductor-forming substrateNISSAN CHEMICAL CORP·Filed 2020·Application pending·0 cites
- 4044US2023137360A1Composition for forming resist underlayer filmNISSAN CHEMICAL CORP·Filed 2021·Application pending·0 cites
- 4143US2023298923A1Multilayer body, release agent composition, and method for producing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2021·Application pending·0 cites
- 4241US11674051B2Stepped substrate coating composition containing compound having curable functional groupNISSAN CHEMICAL CORP·Filed 2018·Granted Jun 13, 2023·0 cites·27 claims
- 4341US2022229368A1Resist underlayer film-forming compositionNISSAN CHEMICAL CORP·Filed 2020·Application pending·0 cites
- 4440US2022155686A1Resist underlayer film-forming compositionNISSAN CHEMICAL CORP·Filed 2020·Application pending·0 cites
- 4540US2020192224A1Resist underlayer film-forming compositionNISSAN CHEMICAL CORP·Filed 2018·Application pending·0 cites
- 4637US2020201183A1Resist underlayer film forming composition containing compound having hydantoin ringNISSAN CHEMICAL CORP·Filed 2017·Application pending·0 cites
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