Inventor · disambiguated record
Hirotaka Okamoto
Also filed as: OKAMOTO HIROTAKA
20 granted patents·4 pending applications·341 citations·filing 1998–2016
95Inventor score
Files withTOYODA CHUO KENKYUSHO KK7TOYOTA MOTOR CO LTD3TOWA CORP2TOYOTA BOSHOKU KK2TOYOTA CHUO KENKYUSHO KK2
Top patents by PatentIndex Score
24 records- 0197US6117932AResin compositeTOYODA CHUO KENKYUSHO KK·Filed 1998·Granted Sep 12, 2000·147 cites·25 claims
- 0295US9840615B2Thermoplastic resin composition, method for producing same, and molded bodyTOYOTA BOSHOKU KK·Filed 2016·Granted Dec 12, 2017·7 cites·20 claims
- 0393US9493642B2Thermoplastic resin composition, method for producing same, and molded bodyTOYOTA BOSHOKU KK·Filed 2012·Granted Nov 15, 2016·10 cites·13 claims
- 0484US6207723B1Rubber composition and method for producing the sameTOYODA CHUO KENKYUSHO KK·Filed 1999·Granted Mar 27, 2001·40 cites·21 claims
- 0583US7910643B2Polylactic acid resin composition, moldings, and process for production thereofADEKA CORP·Filed 2005·Granted Mar 22, 2011·5 cites·17 claims
- 0678US7585910B2Polylactic acid compositionTOYOTA CHUO KENKYUSHO KK·Filed 2006·Granted Sep 8, 2009·3 cites·18 claims
- 0775US6777453B1Method of reclaiming crosslinked rubber, and molded article of reclaimed rubberTOYODA CHUO KENKYUSHO KK·Filed 2000·Granted Aug 17, 2004·14 cites·18 claims
- 0874US7084192B2Polylactic acid composite material and molded bodyTOYOTA MOTOR CO LTD·Filed 2003·Granted Aug 1, 2006·10 cites·19 claims
- 0974US6436331B1Method of resin sealing a gap between a semiconductor chip and a substrateTOWA CORP·Filed 2000·Granted Aug 20, 2002·13 cites·15 claims
- 1072US6632918B1Method of reclaiming crosslinked rubberTOYODA CHUO KENKYUSHO KK·Filed 2000·Granted Oct 14, 2003·12 cites·14 claims
- 1171US6316508B1Rubber composition and method for producing the sameTOYODA CHUO KENKYUSHO KK·Filed 2000·Granted Nov 13, 2001·8 cites·18 claims
- 1270US9586787B2Cord reel devicePANASONIC IP MAN CO LTD·Filed 2013·Granted Mar 7, 2017·2 cites·8 claims
- 1370US7825212B2Polylactic acid resin and composition and molded article of the sameTOYOTA MOTOR CO LTD·Filed 2004·Granted Nov 2, 2010·7 cites·4 claims
- 1467US6472460B1Polymer composite material and process for preparing the sameTOYODA CHUO KENKYUSHO KK·Filed 1998·Granted Oct 29, 2002·23 cites·13 claims
- 1567US6178156B1Disk recording and reproduction apparatus and dynamic damper thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Jan 23, 2001·23 cites·4 claims
- 1663US6438826B2Electronic component, method of sealing electronic component with resin, and apparatus thereforTOWA CORP·Filed 2001·Granted Aug 27, 2002·13 cites·14 claims
- 1760US6821464B2Process for producing polymer/filler composite materialTOYODA CHUO KENKYUSHO KK·Filed 2002·Granted Nov 23, 2004·3 cites·19 claims
- 1853US2016211512A1Negative-electrode active material and electric storage apparatusTOYOTA JIDOSHOKKI KK·Filed 2014·Application pending·0 cites
- 1947US9927137B2Air-conditioning control device generating air-conditioning control-data, air-conditioning control method, and computer program productHIRAOKA YUKIO·Filed 2012·Granted Mar 27, 2018·1 cites·10 claims
- 2047US9728294B2Resin composite materialTANAKA HIROMITSU·Filed 2011·Granted Aug 8, 2017·0 cites·19 claims
- 2147US2006142505A1Aliphatic polyester composition and its molded articleTOYOTA MOTOR CO LTD·Filed 2005·Application pending·0 cites
- 2243US11633892B2Metal-resin bonded member and method of manufacturing the sameTOYOTA CHUO KENKYUSHO KK·Filed 2016·Granted Apr 25, 2023·0 cites·11 claims
- 2343US2006226380A1Method of inspecting a broad articleMEINAN MACHINERY WORKS·Filed 2005·Application pending·0 cites
- 2442US2007032631A1Polylactic acid resin composition, process for producing the same and molding thereofTJOYOTA JIDOSHA KABUSHIKI KAIS·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →